Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

JS Liang; D Yang; QY Li; LJ Ernst; GQ Zhang

Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

JS Liang, D Yang, QY Li, LJ Ernst, GQ Zhang

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Thermal & mechanical simulation and experiments in microelectronics and microsystems
Editors	LJ Ernst, GQ Zhang, R Dudek, O de Saint Leger
Place of Publication	Piscataway
Publisher	IEEE
Pages	455-463
Number of pages	9
ISBN (Print)	0-7803-7054-6
Publication status	Published - 2003
Event	EuroSimE 2003: 4th International Conference - Aix-en-Provence, France Duration: 30 Mar 2003 → 2 Apr 2003 Conference number: 4

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2003
Country/Territory	France
City	Aix-en-Provence
Period	30/03/03 → 2/04/03

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{6747471516be4edd8c70ae406ab51884,

title = "Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach",

keywords = "Conf.proc. > 3 pag",

author = "JS Liang and D Yang and QY Li and LJ Ernst and GQ Zhang",

year = "2003",

language = "Undefined/Unknown",

isbn = "0-7803-7054-6",

publisher = "IEEE",

pages = "455--463",

editor = "LJ Ernst and GQ Zhang and R Dudek and {de Saint Leger}, O",

booktitle = "Thermal & mechanical simulation and experiments in microelectronics and microsystems",

address = "United States",

note = "EuroSimE 2003 ; Conference date: 30-03-2003 Through 02-04-2003",

}

Liang, JS, Yang, D, Li, QY, Ernst, LJ & Zhang, GQ 2003, Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach. in LJ Ernst, GQ Zhang, R Dudek & O de Saint Leger (eds), Thermal & mechanical simulation and experiments in microelectronics and microsystems. IEEE, Piscataway, pp. 455-463, EuroSimE 2003, Aix-en-Provence, France, 30/03/03.

Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach. / Liang, JS; Yang, D; Li, QY et al.
Thermal & mechanical simulation and experiments in microelectronics and microsystems. ed. / LJ Ernst; GQ Zhang; R Dudek; O de Saint Leger. Piscataway: IEEE, 2003. p. 455-463.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

AU - Liang, JS

AU - Yang, D

AU - Li, QY

AU - Ernst, LJ

AU - Zhang, GQ

N1 - Conference code: 4

PY - 2003

Y1 - 2003

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-7054-6

SP - 455

EP - 463

BT - Thermal & mechanical simulation and experiments in microelectronics and microsystems

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Dudek, R

A2 - de Saint Leger, O

PB - IEEE

CY - Piscataway

T2 - EuroSimE 2003

Y2 - 30 March 2003 through 2 April 2003

ER -