Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

JS Liang, D Yang, QY Li, LJ Ernst, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationThermal & mechanical simulation and experiments in microelectronics and microsystems
EditorsLJ Ernst, GQ Zhang, R Dudek, O de Saint Leger
Place of PublicationPiscataway
PublisherIEEE Society
Pages455-463
Number of pages9
ISBN (Print)0-7803-7054-6
Publication statusPublished - 2003
EventEuroSimE 2003: 4th International Conference - Aix-en-Provence, France
Duration: 30 Mar 20032 Apr 2003
Conference number: 4

Publication series

Name
PublisherIEEE

Conference

ConferenceEuroSimE 2003
CountryFrance
CityAix-en-Provence
Period30/03/032/04/03

Keywords

  • Conf.proc. > 3 pag

Cite this

Liang, JS., Yang, D., Li, QY., Ernst, LJ., & Zhang, GQ. (2003). Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach. In LJ. Ernst, GQ. Zhang, R. Dudek, & O. de Saint Leger (Eds.), Thermal & mechanical simulation and experiments in microelectronics and microsystems (pp. 455-463). IEEE Society.