Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

JS Liang, D Yang, QY Li, LJ Ernst, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationThermal & mechanical simulation and experiments in microelectronics and microsystems
EditorsLJ Ernst, GQ Zhang, R Dudek, O de Saint Leger
Place of PublicationPiscataway
PublisherIEEE Society
Pages455-463
Number of pages9
ISBN (Print)0-7803-7054-6
Publication statusPublished - 2003
EventEuroSimE 2003: 4th International Conference - Aix-en-Provence, France
Duration: 30 Mar 20032 Apr 2003
Conference number: 4

Publication series

Name
PublisherIEEE

Conference

ConferenceEuroSimE 2003
CountryFrance
CityAix-en-Provence
Period30/03/032/04/03

Keywords

  • Conf.proc. > 3 pag

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