Polymer-based 2D/3D wafer level heterogeneous integration for SSL module

CA Yuan, J Wei, H Ye, SW Koh, S Harianto, M van den Nieuwenhof, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
EditorsO De Saint Leger et al
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages712-718
Number of pages7
ISBN (Print)978-1-4673-1512-8
DOIs
Publication statusPublished - 2012
EventEuroSimE 2012: 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Lisbon, Portugal
Duration: 16 Apr 201218 Apr 2012
Conference number: 13

Publication series

Name
PublisherIEEE

Conference

ConferenceEuroSimE 2012
CountryPortugal
CityLisbon
Period16/04/1218/04/12

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