Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry

WD van Driel, GQ Zhang, J Janssen, LJ Ernst, F Su, S Yi

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publication3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics
EditorsLJ Ernst, GQ Zhang, R Dudek, O de Saint Leger
Place of PublicationPiscataway
PublisherThe Institute of Electrical and Electronics Engineers
Pages362-368
Number of pages7
ISBN (Print)0-7803-9819-X
Publication statusPublished - 2002
EventEuroSimE 2002 - Paris, France
Duration: 15 Apr 200217 Apr 2002

Conference

ConferenceEuroSimE 2002
CountryFrance
CityParis
Period15/04/0217/04/02

Keywords

  • Conf.proc. > 3 pag

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