Prediction and verification of process induced warpage of electronic packages

WD van Driel, GQ Zhang, JHJ Janssen, LJ Ernst, F Su, KS Chian, S Yi

Research output: Contribution to journalArticleScientificpeer-review

51 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)765-774
Number of pages10
JournalMicroelectronics Reliability
Publication statusPublished - 2003


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