Processability and electrical characteristic of glass substrates for RF wafer-level chip-scale packages

A Poliakov; P Mendes; SM Sinaga; B Rejaei Salmassi; JH Correia; JN Burghartz

Processability and electrical characteristic of glass substrates for RF wafer-level chip-scale packages

A Poliakov, P Mendes, SM Sinaga, B Rejaei Salmassi, JH Correia, JN Burghartz

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

28 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proceedings 53rd electronic compenents and technology conference
Editors	s.n.
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	875-880
Number of pages	6
ISBN (Print)	0-7803-7430-4
Publication status	Published - 2003
Event	53rd electronic compenents and technology conference, New Orleans, Louisiana, USA - Piscataway Duration: 27 May 2003 → 30 May 2003

Publication series

Name
Publisher	IEEE

Conference

Conference	53rd electronic compenents and technology conference, New Orleans, Louisiana, USA
Period	27/05/03 → 30/05/03

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{41523b337372469f89ee4e44e682a4c1,

title = "Processability and electrical characteristic of glass substrates for RF wafer-level chip-scale packages",

keywords = "Conf.proc. > 3 pag",

author = "A Poliakov and P Mendes and SM Sinaga and {Rejaei Salmassi}, B and JH Correia and JN Burghartz",

year = "2003",

language = "Undefined/Unknown",

isbn = "0-7803-7430-4",

publisher = "IEEE Society",

pages = "875--880",

editor = "s.n.",

booktitle = "Proceedings 53rd electronic compenents and technology conference",

note = "53rd electronic compenents and technology conference, New Orleans, Louisiana, USA ; Conference date: 27-05-2003 Through 30-05-2003",

}

Poliakov, A, Mendes, P, Sinaga, SM, Rejaei Salmassi, B, Correia, JH & Burghartz, JN 2003, Processability and electrical characteristic of glass substrates for RF wafer-level chip-scale packages. in s.n. (ed.), Proceedings 53rd electronic compenents and technology conference. IEEE Society, Piscataway, pp. 875-880, 53rd electronic compenents and technology conference, New Orleans, Louisiana, USA, 27/05/03.

Processability and electrical characteristic of glass substrates for RF wafer-level chip-scale packages. / Poliakov, A; Mendes, P; Sinaga, SM et al.
Proceedings 53rd electronic compenents and technology conference. ed. / s.n. Piscataway: IEEE Society, 2003. p. 875-880.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Processability and electrical characteristic of glass substrates for RF wafer-level chip-scale packages

AU - Poliakov, A

AU - Mendes, P

AU - Sinaga, SM

AU - Rejaei Salmassi, B

AU - Correia, JH

AU - Burghartz, JN

PY - 2003

Y1 - 2003

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-7430-4

SP - 875

EP - 880

BT - Proceedings 53rd electronic compenents and technology conference

A2 - s.n., null

PB - IEEE Society

CY - Piscataway

T2 - 53rd electronic compenents and technology conference, New Orleans, Louisiana, USA

Y2 - 27 May 2003 through 30 May 2003

ER -