Processability and electrical characteristic of glass substrates for RF wafer-level chip-scale packages

A Poliakov, P Mendes, SM Sinaga, B Rejaei Salmassi, JH Correia, JN Burghartz

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

26 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings 53rd electronic compenents and technology conference
Editors s.n.
Place of PublicationPiscataway
PublisherIEEE Society
Pages875-880
Number of pages6
ISBN (Print)0-7803-7430-4
Publication statusPublished - 2003
Event53rd electronic compenents and technology conference, New Orleans, Louisiana, USA - Piscataway
Duration: 27 May 200330 May 2003

Publication series

Name
PublisherIEEE

Conference

Conference53rd electronic compenents and technology conference, New Orleans, Louisiana, USA
Period27/05/0330/05/03

Keywords

  • Conf.proc. > 3 pag

Cite this

Poliakov, A., Mendes, P., Sinaga, SM., Rejaei Salmassi, B., Correia, JH., & Burghartz, JN. (2003). Processability and electrical characteristic of glass substrates for RF wafer-level chip-scale packages. In s.n. (Ed.), Proceedings 53rd electronic compenents and technology conference (pp. 875-880). IEEE Society.