Squeeze, rock, and roll; Can tangible interaction with affective products support stress reduction?

M Bruns, DV Keyson, CCM Hummels

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

27 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings of the Second International Conference on Tangible and Embedded Interaction (TEI'08)
EditorsA Schmidt, H Gellersen
Place of PublicationNew York
PublisherAssociation for Computing Machinery (ACM)
Pages105-108
Number of pages4
ISBN (Print)978-1-60558-004-3
Publication statusPublished - 2008
EventSecond International Conference on Tangible and Embedded Interaction (TEI'08), Bonn - New York
Duration: 18 Feb 200820 Feb 2008

Publication series

Name
PublisherACM

Conference

ConferenceSecond International Conference on Tangible and Embedded Interaction (TEI'08), Bonn
Period18/02/0820/02/08

Keywords

  • Conf.proc. > 3 pag

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