Study of thermal behaviour in a multi-chip-composed optoelectronic package

J Tian, SM Sinaga, M Bartek

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proc. 16th European Microelectronics and Packaging Conference & Exhibition (EMPC 2007)
Editors	n.s.
Place of Publication	Oulu
Publisher	IMAPS
Pages	262-267
Number of pages	6
ISBN (Print)	978-952-99751-1-2
Publication status	Published - 2007
Event	16th European Microelectronics and Packaging Conference & Exhibition (EMPC 2007) - Oulu Duration: 17 Jun 2007 → 20 Jun 2007

Name
Publisher	IMAPS

Conference	16th European Microelectronics and Packaging Conference & Exhibition (EMPC 2007)
Period	17/06/07 → 20/06/07

Keywords

@inproceedings{ae3f5a0bb16f4b7d8911ccfacfdd5da1,

title = "Study of thermal behaviour in a multi-chip-composed optoelectronic package",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "J Tian and SM Sinaga and M Bartek",

year = "2007",

language = "Undefined/Unknown",

isbn = "978-952-99751-1-2",

publisher = "IMAPS",

pages = "262--267",

editor = "n.s.",

booktitle = "Proc. 16th European Microelectronics and Packaging Conference & Exhibition (EMPC 2007)",

note = "16th European Microelectronics and Packaging Conference & Exhibition (EMPC 2007) ; Conference date: 17-06-2007 Through 20-06-2007",

}

TY - GEN

T1 - Study of thermal behaviour in a multi-chip-composed optoelectronic package

AU - Tian, J

AU - Sinaga, SM

AU - Bartek, M

PY - 2007

Y1 - 2007

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-952-99751-1-2

SP - 262

EP - 267

BT - Proc. 16th European Microelectronics and Packaging Conference & Exhibition (EMPC 2007)

A2 - n.s., null

PB - IMAPS

CY - Oulu

T2 - 16th European Microelectronics and Packaging Conference & Exhibition (EMPC 2007)

Y2 - 17 June 2007 through 20 June 2007

ER -