Superconducting High-Aspect Ratio Through-Silicon Vias with DC-Sputtered Al for Quantum 3D integration

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Abstract

This paper presents the fabrication and electrical characterization of superconducting high-aspect ratio through-silicon vias DC-sputtered with aluminum. Fully conformal and void-free coating of 300 μm-deep and 50 μmwide vias with Al, a CMOS-compatible and widely available superconductor, was made possible by tailoring a funneled sidewall profile for the axisymmetric vias. Single-via electric resistance as low as 80.44 mΩ at room temperature and superconductivity below 1.28 K were measured by a crossbridge Kelvin resistor structure. This work thus demonstrates the fabrication of functional superconducting interposer layers, suitable for high-density 3D integration of silicon-based quantum computing architectures.
Original languageEnglish
Pages (from-to)1114-1117
Number of pages4
JournalIEEE Electron Device Letters
Volume41
Issue number7
DOIs
Publication statusPublished - Jul 2020

Keywords

  • Aluminum
  • cryogenic
  • interconnects
  • sputtering
  • superconducting
  • through-silicon vias

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