Synergistic toughening of epoxy¿copper interface using a thiol-based coupling layer

CKY Wong, SYY Leung, H Fan, MMF Yuen

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	Undefined/Unknown
Pages (from-to)	2081-2099
Number of pages	19
Journal	Journal of Adhesion Science and Technology
Volume	25
Issue number	16
Publication status	Published - 2011

Keywords

@article{03279cee871d44b6b521b4fa6cafc58e,

title = "Synergistic toughening of epoxy¿copper interface using a thiol-based coupling layer",

keywords = "academic journal papers, CWTS JFIS < 0.75",

author = "CKY Wong and SYY Leung and H Fan and MMF Yuen",

year = "2011",

language = "Undefined/Unknown",

volume = "25",

pages = "2081--2099",

journal = "Journal of Adhesion Science and Technology",

issn = "0169-4243",

publisher = "Taylor & Francis",

number = "16",

}

TY - JOUR

T1 - Synergistic toughening of epoxy¿copper interface using a thiol-based coupling layer

AU - Wong, CKY

AU - Leung, SYY

AU - Fan, H

AU - Yuen, MMF

PY - 2011

Y1 - 2011

KW - academic journal papers

KW - CWTS JFIS < 0.75

UR - http://www.ingentaconnect.com/content/vsp/ast/2011/00000025/00000016/art00009

M3 - Article

SN - 0169-4243

VL - 25

SP - 2081

EP - 2099

JO - Journal of Adhesion Science and Technology

JF - Journal of Adhesion Science and Technology

IS - 16

ER -