Synergistic toughening of epoxy¿copper interface using a thiol-based coupling layer

CKY Wong, SYY Leung, H Fan, MMF Yuen

Research output: Contribution to journalArticleScientificpeer-review

5 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)2081-2099
Number of pages19
JournalJournal of Adhesion Science and Technology
Issue number16
Publication statusPublished - 2011


  • academic journal papers
  • CWTS JFIS < 0.75

Cite this