Thermal Cone Penetration Test (T-CPT)

Phil Vardon, Dimitris Baltoukas, Joek Peuchen

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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The Thermal Cone Penetration Test (T-CPT) records temperature dissipation during an interruption of the Cone Penetration Test (CPT) to determine the thermal properties of the ground, taking advantage of heat generated in the cone penetrometer during normal operation. This paper compares two interpretation models for thermal conductivity. It is found that the thermal conductivity can
be accurately determined. Care must be taken of the initial heat distribution and sensor location within the temperature cone to achieve accurate results. Furthermore, laboratory test data are presented that show that the full-displacement push of a penetrometer into sandy strata has limited influence on thermal conductivity values.
Original languageEnglish
Title of host publicationCone Penetration Testing 2018
Subtitle of host publicationProceedings of the 4th International Symposium on Cone Penetration Testing (CPT'18), 21-22 June, 2018, Delft, The Netherlands
EditorsMichael A. Hicks, Federico Pisano, Joek Peuchen
Place of PublicationLondon
PublisherCRC Press
ISBN (Electronic)978-0-429-50598-0
ISBN (Print)978-1-138-58449-5
Publication statusPublished - 21 Jun 2018
Event4th International Symposium on Cone Penetration testing - Aula Conference Centre, Delft, Netherlands
Duration: 21 Jun 201822 Jun 2018
Conference number: 4


Conference4th International Symposium on Cone Penetration testing
Abbreviated titleCPT18
OtherCPT’18 will focus on the solution of geotechnical challenges using the cone penetration test (CPT), CPT add-on measurements and companion in-situ penetration tools (such as full flow and free fall penetrometers), with particular emphasis on practical experience and application of research findings. As CPTs play a major role in geo-engineering, CPT’18 will bring together the world’s experts who are working to improve the quality and reduce the difficulties involved. The symposium will be attended by academics, researchers, consultants, practitioners, hardware/software suppliers, certifiers and students. It will be a unique opportunity for meeting people and sharing high-level knowledge.
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