Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network
Research output: Contribution to journal › Article › Scientific › peer-review
21Downloads
(Pure)
Fingerprint
Dive into the research topics of 'Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network'. Together they form a unique fingerprint.