Virtual thermo-mechanical prototyping of electronic packaging - the bottlenecks and solutions for damage modeling

G.Q. Zhang, AAO Tay, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

13 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings of 3rd electronics packaging technology conference, December 5-7
Editors TB Lim, C Lee, KC Toh
Place of PublicationPiscataway, NJ
PublisherIEEE Society
Pages263-269
Number of pages7
ISBN (Print)0-7803-6644-1
Publication statusPublished - 2000
EventEPTC 2000, Singapore - Piscataway, NJ
Duration: 5 Dec 20007 Dec 2000

Publication series

Name
PublisherIEEE

Conference

ConferenceEPTC 2000, Singapore
Period5/12/007/12/00

Keywords

  • ZX Int.klas.verslagjaar < 2002

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