Virtual thermo-mechanical prototyping of electronic packaging - the bottlenecks and solutions for damage modeling

G.Q. Zhang; AAO Tay; LJ Ernst

Virtual thermo-mechanical prototyping of electronic packaging - the bottlenecks and solutions for damage modeling

G.Q. Zhang, AAO Tay, LJ Ernst

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Proceedings of 3rd electronics packaging technology conference, December 5-7
Editors	TB Lim, C Lee, KC Toh
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	263-269
Number of pages	7
ISBN (Print)	0-7803-6644-1
Publication status	Published - 2000
Event	EPTC 2000, Singapore - Piscataway, NJ Duration: 5 Dec 2000 → 7 Dec 2000

Publication series

Name
Publisher	IEEE

Conference

Conference	EPTC 2000, Singapore
Period	5/12/00 → 7/12/00

Keywords

ZX Int.klas.verslagjaar < 2002

Cite this

@inproceedings{ea1c724ab65c441ba00f3d9fb448fa38,

title = "Virtual thermo-mechanical prototyping of electronic packaging - the bottlenecks and solutions for damage modeling",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "G.Q. Zhang and AAO Tay and LJ Ernst",

year = "2000",

language = "Undefined/Unknown",

isbn = "0-7803-6644-1",

publisher = "IEEE",

pages = "263--269",

editor = "{TB Lim} and {C Lee} and {KC Toh}",

booktitle = "Proceedings of 3rd electronics packaging technology conference, December 5-7",

address = "United States",

note = "EPTC 2000, Singapore ; Conference date: 05-12-2000 Through 07-12-2000",

}

Virtual thermo-mechanical prototyping of electronic packaging - the bottlenecks and solutions for damage modeling. / Zhang, G.Q.; Tay, AAO; Ernst, LJ.
Proceedings of 3rd electronics packaging technology conference, December 5-7. ed. / TB Lim; C Lee; KC Toh. Piscataway, NJ: IEEE, 2000. p. 263-269.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Virtual thermo-mechanical prototyping of electronic packaging - the bottlenecks and solutions for damage modeling

AU - Zhang, G.Q.

AU - Tay, AAO

AU - Ernst, LJ

PY - 2000

Y1 - 2000

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SN - 0-7803-6644-1

SP - 263

EP - 269

BT - Proceedings of 3rd electronics packaging technology conference, December 5-7

A2 - TB Lim, null

A2 - C Lee, null

A2 - KC Toh, null

PB - IEEE

CY - Piscataway, NJ

T2 - EPTC 2000, Singapore

Y2 - 5 December 2000 through 7 December 2000

ER -