Wafer-level packaging for rf applications using low-loss spacer substrate for integration of passives

SM Sinaga, A Poliakov, M Bartek

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Original languageUndefined/Unknown
    Title of host publicationProceedings of the 1st international workshop on 3S (SoP, SiP, SoC) electronic technologies
    Editors s.n.
    Place of Publications.l.
    Publishers.n.
    Pages-
    Publication statusPublished - 2005
    Event1st international workshop on 3S (SoP, SiP, SoC) electronic technologies, Atlanta, USA - s.l.
    Duration: 22 Sep 200523 Sep 2005

    Publication series

    Name
    Publishers.n.

    Conference

    Conference1st international workshop on 3S (SoP, SiP, SoC) electronic technologies, Atlanta, USA
    Period22/09/0523/09/05

    Keywords

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