Wafer-level packaging for rf applications using low-loss spacer substrate for integration of passives

SM Sinaga, A Poliakov, M Bartek

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 1st international workshop on 3S (SoP, SiP, SoC) electronic technologies
Editors	s.n.
Place of Publication	s.l.
Publisher	s.n.
Pages	-
Publication status	Published - 2005
Event	1st international workshop on 3S (SoP, SiP, SoC) electronic technologies, Atlanta, USA - s.l. Duration: 22 Sept 2005 → 23 Sept 2005

Name
Publisher	s.n.

Conference	1st international workshop on 3S (SoP, SiP, SoC) electronic technologies, Atlanta, USA
Period	22/09/05 → 23/09/05

Keywords

@inproceedings{46e28ccc07284d7fb4572e4b066d4412,

title = "Wafer-level packaging for rf applications using low-loss spacer substrate for integration of passives",

keywords = "Geen BTA classificatie",

author = "SM Sinaga and A Poliakov and M Bartek",

year = "2005",

language = "Undefined/Unknown",

publisher = "s.n.",

pages = "--",

editor = "s.n.",

booktitle = "Proceedings of the 1st international workshop on 3S (SoP, SiP, SoC) electronic technologies",

note = "1st international workshop on 3S (SoP, SiP, SoC) electronic technologies, Atlanta, USA ; Conference date: 22-09-2005 Through 23-09-2005",

}

Wafer-level packaging for rf applications using low-loss spacer substrate for integration of passives. / Sinaga, SM; Poliakov, A; Bartek, M.
Proceedings of the 1st international workshop on 3S (SoP, SiP, SoC) electronic technologies. ed. / s.n. s.l.: s.n., 2005. p. -.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Wafer-level packaging for rf applications using low-loss spacer substrate for integration of passives

AU - Sinaga, SM

AU - Poliakov, A

AU - Bartek, M

PY - 2005

Y1 - 2005

KW - Geen BTA classificatie

M3 - Conference contribution

SP - -

BT - Proceedings of the 1st international workshop on 3S (SoP, SiP, SoC) electronic technologies

A2 - s.n., null

PB - s.n.

CY - s.l.

T2 - 1st international workshop on 3S (SoP, SiP, SoC) electronic technologies, Atlanta, USA

Y2 - 22 September 2005 through 23 September 2005

ER -