No photo of S. Deng

S. Deng

 https://orcid.org/0000-0002-3417-475X
  • 1 Conference contribution
  • 1 Article
  • 1 Review article
  • 1 Patent
Filter
Conference contribution

Search results

  • 2024

    Multi-parameters optimization for electromigration in WLCSP solder bumps

    Du, L., Deng, S., Cui, Z., Poelma, R., Beelen-Hendrikx, C. & Zhang, K., 2024, Proceedings of the 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 4 p. (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

    Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review