3D interconnect technology based on low temperature copper nanoparticle sintering

Boyao Zhang, Yorick Carisey, A. Damian, Rene Poelma, Guo Qi Zhang, Henk van Zeijl

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)
57 Downloads (Pure)

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Physics & Astronomy