Research output per year
Research output per year
Fingerprint
Dive into the research topics where H.W. van Zeijl is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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A Die Attach Sinter Material And Method
Zhang, B., van Zeijl, H. W. & Smits, E. C. P., 2025, IPC No. C22C, B22F, Priority date 29 Aug 2023, Priority No. EP 23194039.6Research output: Patent
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Effects of humidity, ionic contaminations and temperature on the degradation of silicone-based sealing materials used in microelectronics
Mehr, M. Y., Hajipour, P., Karampoor, M. R., van Zeijl, H., van Driel, W. D., Cooremans, T., De Buyl, F. & Zhang, G. Q., 2025, In: Microelectronics Reliability. 164, 6 p., 115554.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile22 Downloads (Pure) -
20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering
Ji, X., Du, L., Van Zeijl, H., Zhang, G., Derakhshandeh, J. & Beyne, E., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. IEEE, p. 1891-1895 5 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
Open AccessFile -
Effects of die top system and trenches on large thin die mechanical robustness
Gupta, N., Poelma, R., Zhang, G., Driel, W. D. V. & van Zeijl, HW., 2024, In: Journal of Micromechanics and Microengineering. 34, 10, 18 p., 105012.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile29 Downloads (Pure) -
A Thin-film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
Sattari, R., Van Zeijl, H. & Zhang, G., 2023, Proceedings of the 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). IEEE, p. 1309-1313 5 p. (Proceedings - Electronic Components and Technology Conference; vol. 2023-May).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
Open AccessFile31 Downloads (Pure)
Activities
- 1 Talk or presentation at a conference
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Self healing thermal interface materials for light emitting diodes
H.W. van Zeijl (Speaker)
2012 → …Activity: Talk or presentation › Talk or presentation at a conference