Abstract
Intra-cardiac echography (ICE) probes (Fig. 32.2.1) are widely used in electrophysiology for their good procedure guidance and relatively safe application. ASICs are increasingly employed in these miniature probes to enhance signal quality and reduce the number of connections needed in mm-diameter catheters [1]-[5]. 3D visualization in real-time is additionally enabled by 2D transducer arrays with, for each transducer element, a high-voltage (HV) transmit (TX) part, to generate acoustic pulses of sufficient pressure, and a receive (RX) path, to process the resulting echoes. To achieve the required reduction in RX channels, micro-beamforming (BF), which merges the signals from a subarray using a delay-and-sum operation, has been shown to be an effective solution [3], [4]. However, due to the frame-rate reduction that is associated with BF, these designs cannot serve emerging high-frame-rate imaging modes (1000 volumes/s) like 3D blood-flow and elastography imaging. In-probe digitization has recently been investigated to provide further channel-count reduction, make data transmission more robust, and enable pre-processing in the probe [1]-[3]. However, these earlier designs have either no TX functionality [2], [3] or only low-voltage (LV) TX [1] integrated. Combining BF and digitization with area-hungry HV transmitters in a pitch-matched scalable fashion while supporting high-frame-rate imaging remains an unmet challenge. The work presented in this paper meets this target, enabled by a hybrid ADC, the small die size of which allows for co-integration with 65V element-level pulsers.
Original language | English |
---|---|
Title of host publication | 2022 IEEE International Solid- State Circuits Conference (ISSCC) |
Subtitle of host publication | Digest of technical papers |
Editors | Laura C. Fujino |
Place of Publication | Danvers |
Publisher | IEEE |
Pages | 494-496 |
Number of pages | 3 |
ISBN (Electronic) | 978-1-6654-2800-2 |
ISBN (Print) | 978-1-6654-2801-9 |
DOIs | |
Publication status | Published - 2022 |
Event | 2022 IEEE International Solid- State Circuits Conference (ISSCC) - Online at San Francisco, United States Duration: 20 Feb 2022 → 26 Feb 2022 |
Publication series
Name | Digest of Technical Papers - IEEE International Solid-State Circuits Conference |
---|---|
Volume | 2022-February |
ISSN (Print) | 0193-6530 |
Conference
Conference | 2022 IEEE International Solid- State Circuits Conference (ISSCC) |
---|---|
Abbreviated title | ISSCC 2022 |
Country/Territory | United States |
City | Online at San Francisco |
Period | 20/02/22 → 26/02/22 |
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-careOtherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Keywords
- Low voltage
- Three-dimensional displays
- Transducers
- Ultrasonic imaging
- Array signal processing
- Transmitters
- Imaging