Comparing drop impact test method using strain gauge measurements

Y Liu, FJHG Kessels, WD van Driel, JAS van Driel, FL Sun, GQ Zhang

Research output: Contribution to journalArticleScientificpeer-review

17 Citations (Scopus)

Abstract

In this paper, strain gauges are used to measure the dynamic response during drop impact. A set of high-speed data acquisition system is used to capture the real-time response of critical locations. Finite Element Modelling is used to determine where to place the strain gauge measurements. Two board level drop impact test methods, A and B, are compared by the strain gauge measurements. Results show significant differences in strain amplitude, strain rate, frequency, rebound, and damping. Method B produces higher strain amplitude, stronger rebound, and less damping, while method A produces higher frequency and strain rate. Damping and rebound are important factors for both test methods. The differences of two test methods are due to the contributions from test condition and test board. Combination test were conducted to investigate the contribution of test condition and test board. Results show that test board dominates strain amplitude, frequency, mode and damping, while test condition shows influence on strain amplitude and rebound. Test condition A produces higher strain amplitude, while test condition B produces stronger rebound. Test board A produces higher frequency, while test board B produces higher strain amplitude and less damping. Test board contributes more to the strain amplitude than test condition. Strain rate is dependent on both the test condition and test board.
Original languageUndefined/Unknown
Pages (from-to)1299-1303
Number of pages5
JournalMicroelectronics Reliability
Volume49
Publication statusPublished - 2009

Keywords

  • academic journal papers
  • CWTS JFIS < 0.75

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