Research output per year
Research output per year
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Dive into the research topics where W.D. van Driel is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound
Inamdar, A. S., van Soestbergen, M., Mavinkurve, A., van Driel, W. D. & Zhang, K., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. 7 p. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific
Open Access -
Degradation of silicone-based sealing materials used in microelectronics
Yazdan Mehr, M., Hajipour, P., van Zeijl, H., van Driel, W. D., Cooremans, T., De Buyl, F. & Zhang, G. Q., 2023, Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE , p. 1-4 4 p. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
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Lifetime Prediction of Current-and Temperature-Induced Degradation in Silicone-Encapsulated 365 nm High-Power Light-Emitting Diodes
Herzog, A., Benkner, S., Zandi, B., Buffolo, M., van Driel, W. D., Meneghini, M. & Khanh, T. Q., 2023, In: IEEE Access. 11, p. 19928-19940 13 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile1 Citation (Scopus)17 Downloads (Pure) -
Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices
Du, L., Hu, D., Poelm, R., van Driel, W. & Zhang, K., 2023, Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE , p. 1-4 4 p. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
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Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device
Hu, X., Martin, H. A., Poelma, R. H., Huang, J. L., Rijckevorsel, H., Scholten, H., Smits, E. C. P., van Driel, W. D. & Zhang, G. Q., 2023, Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE , p. 1-7 7 p. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
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Springer (Publisher)
W.D. van Driel (Editor)
2012 → …Activity: Publication peer-review and editorial work › Editorial activity
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IEEE society (Publisher)
W.D. van Driel (Editor)
2011 → …Activity: Publication peer-review and editorial work › Publication peer-review
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IEEE society (Publisher)
W.D. van Driel (Editor)
2010 → …Activity: Publication peer-review and editorial work › Publication peer-review
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IEEE society (Publisher)
W.D. van Driel (Editor)
2009 → …Activity: Publication peer-review and editorial work › Editorial activity
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IEEE-CMMT (Publisher)
W.D. van Driel (Editor)
2008 → …Activity: Publication peer-review and editorial work › Editorial activity