Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application

Dong Hu; Mustafeez Bashir Shah; Jiajie Fan; Sten Vollebregt; Guoqi Zhang

doi:10.1109/TED.2023.3312066

Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application

Dong Hu, Mustafeez Bashir Shah, Jiajie Fan, Sten Vollebregt, Guoqi Zhang

Electronic Components, Technology and Materials

Research output: Contribution to journal › Article › Scientific › peer-review

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Abstract

Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size Cu paste sealing ring was achieved using a lithography patterned photoresist as a stencil mask. A groove-structured chip was used to amplify localized stress. The Cu nanoparticle paste was fully sintered at 300 °C under pressure ranging from 10 to 40 MPa resulting in a robust bonding with a maximum shear strength of 280 MPa and implementing hermetic packaging. The deflection of the Si diaphragms estimated a vacuum level of 7 kPa. Vacuum sealing was maintained for over six months, and the lowest leak rate was calculated as 8.4× 10 ^-13Pa·m ³/s. The developed technology that comprises small-size patterning and pressure-assisted sintering offers the potential for a simple, cost-effective, but robust solution for hermetic packaging.

Original language	English
Pages (from-to)	5818 - 5823
Number of pages	6
Journal	IEEE Transactions on Electron Devices
Volume	70
Issue number	11
DOIs	https://doi.org/10.1109/TED.2023.3312066
Publication status	Published - 2023

Bibliographical note

Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

Bonding
Cu nanoparticle
hermetic packaging
leak rate
Packaging
Periodic structures
pressure-assisted sintering
Resists
Silicon
Sintering
Temperature sensors

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Copper_Nanoparticle_Sintering_Enabled_Hermetic_Packaging_With_Fine_Sealing_Ring_for_MEMS_ApplicationFinal published version, 10.2 MB

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@article{de1099dee9d540fabef3275e88b8afce,

title = "Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application",

abstract = "Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size Cu paste sealing ring was achieved using a lithography patterned photoresist as a stencil mask. A groove-structured chip was used to amplify localized stress. The Cu nanoparticle paste was fully sintered at 300 °C under pressure ranging from 10 to 40 MPa resulting in a robust bonding with a maximum shear strength of 280 MPa and implementing hermetic packaging. The deflection of the Si diaphragms estimated a vacuum level of 7 kPa. Vacuum sealing was maintained for over six months, and the lowest leak rate was calculated as 8.4× 10 -13Pa·m 3/s. The developed technology that comprises small-size patterning and pressure-assisted sintering offers the potential for a simple, cost-effective, but robust solution for hermetic packaging.",

keywords = "Bonding, Cu nanoparticle, hermetic packaging, leak rate, Packaging, Periodic structures, pressure-assisted sintering, Resists, Silicon, Sintering, Temperature sensors",

author = "Dong Hu and Shah, {Mustafeez Bashir} and Jiajie Fan and Sten Vollebregt and Guoqi Zhang",

note = "Green Open Access added to TU Delft Institutional Repository {\textquoteleft}You share, we take care!{\textquoteright} – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. ",

year = "2023",

doi = "10.1109/TED.2023.3312066",

language = "English",

volume = "70",

pages = "5818 -- 5823",

journal = "IEEE Transactions on Electron Devices",

issn = "0018-9383",

publisher = "IEEE",

number = "11",

}

TY - JOUR

T1 - Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application

AU - Hu, Dong

AU - Shah, Mustafeez Bashir

AU - Fan, Jiajie

AU - Vollebregt, Sten

AU - Zhang, Guoqi

N1 - Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

PY - 2023

Y1 - 2023

N2 - Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size Cu paste sealing ring was achieved using a lithography patterned photoresist as a stencil mask. A groove-structured chip was used to amplify localized stress. The Cu nanoparticle paste was fully sintered at 300 °C under pressure ranging from 10 to 40 MPa resulting in a robust bonding with a maximum shear strength of 280 MPa and implementing hermetic packaging. The deflection of the Si diaphragms estimated a vacuum level of 7 kPa. Vacuum sealing was maintained for over six months, and the lowest leak rate was calculated as 8.4× 10 -13Pa·m 3/s. The developed technology that comprises small-size patterning and pressure-assisted sintering offers the potential for a simple, cost-effective, but robust solution for hermetic packaging.

AB - Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size Cu paste sealing ring was achieved using a lithography patterned photoresist as a stencil mask. A groove-structured chip was used to amplify localized stress. The Cu nanoparticle paste was fully sintered at 300 °C under pressure ranging from 10 to 40 MPa resulting in a robust bonding with a maximum shear strength of 280 MPa and implementing hermetic packaging. The deflection of the Si diaphragms estimated a vacuum level of 7 kPa. Vacuum sealing was maintained for over six months, and the lowest leak rate was calculated as 8.4× 10 -13Pa·m 3/s. The developed technology that comprises small-size patterning and pressure-assisted sintering offers the potential for a simple, cost-effective, but robust solution for hermetic packaging.

KW - Bonding

KW - Cu nanoparticle

KW - hermetic packaging

KW - leak rate

KW - Packaging

KW - Periodic structures

KW - pressure-assisted sintering

KW - Resists

KW - Silicon

KW - Sintering

KW - Temperature sensors

UR - http://www.scopus.com/inward/record.url?scp=85171589135&partnerID=8YFLogxK

U2 - 10.1109/TED.2023.3312066

DO - 10.1109/TED.2023.3312066

M3 - Article

AN - SCOPUS:85171589135

SN - 0018-9383

VL - 70

SP - 5818

EP - 5823

JO - IEEE Transactions on Electron Devices

JF - IEEE Transactions on Electron Devices

IS - 11

ER -

Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application

Abstract

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Keywords

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