Driving mechanisms of delamination related reliability problems in exposed pad packages

WD van Driel, HJL Bressers, JHJ Janssen, JA Bielen, X Yan, MAJ van Gils, PMP Stevens, PJJHA Habets, GQ Zhang, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

14 Citations (Scopus)
Original languageEnglish
Title of host publicationThermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings of EuroSIME 2005
Editors Ernst, LJ, Zhang, GQ, Rodgers, P, Meuwissen, M, Marco, S, Saint Leger, O de
PublisherIEEE Society
Pages183-189
Number of pages7
ISBN (Print)0-7803-9062-8
Publication statusPublished - 2005
EventEuroSimE 2005: 6th Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Berlin, Germany
Duration: 17 Apr 200520 Apr 2005
Conference number: 6

Publication series

Name
PublisherIEEE

Conference

ConferenceEuroSimE 2005
CountryGermany
CityBerlin
Period17/04/0520/04/05

Bibliographical note

Nog niet eerder opgevoerd

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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