Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages

Chengshuo Jiang, Jiajie Fan, Cheng Qian, Hao Zhang, Xuejun Fan, Weiling Guo, Guoqi Zhang

Research output: Contribution to journalArticleScientificpeer-review

22 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science