Enhancing the wettability of high aspect-ratio through-silicon vias lined with LPCVD silicon nitride of PE-ALD titanium nitride for void-free bottom-up copper electroplating

M Saadaoui, H van Zeijl, WHA Wien, HTM Pham, C Kwakernaak, HCM Knoops, WMM Kessels, RMCM van de Sanden, FC Voogt, F Roozeboom, PM Sarro

Research output: Contribution to journalArticleScientificpeer-review

7 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)1728-1738
Number of pages11
JournalIEEE Transactions on Components and Packaging Technology
Issue number11
Publication statusPublished - 2011


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