Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation

J Tang, D Gruber, JBJ Schelen, H-J Funke, CIM Beenakker

Research output: Contribution to journalArticleScientificpeer-review

8 Citations (Scopus)
Original languageEnglish
Pages (from-to)175-178
Number of pages4
JournalECS Journal of Solid State Science and Technology
Issue number4
Publication statusPublished - 2012

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