Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation

J Tang, D Gruber, JBJ Schelen, H-J Funke, CIM Beenakker

Research output: Contribution to journal › Article › Scientific › peer-review

8 Citations (Scopus)

Original language	English
Pages (from-to)	175-178
Number of pages	4
Journal	ECS Journal of Solid State Science and Technology
Volume	1
Issue number	4
DOIs	https://doi.org/10.1149/2.019204jss
Publication status	Published - 2012

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title = "Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation",

author = "J Tang and D Gruber and JBJ Schelen and H-J Funke and CIM Beenakker",

year = "2012",

doi = "10.1149/2.019204jss",

language = "English",

volume = "1",

pages = "175--178",

journal = "ECS Journal of Solid State Science and Technology",

issn = "2162-8769",

publisher = "Electrochemical Society, Inc.",

number = "4",

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TY - JOUR

T1 - Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation

AU - Tang, J

AU - Gruber, D

AU - Schelen, JBJ

AU - Funke, H-J

AU - Beenakker, CIM

PY - 2012

Y1 - 2012

U2 - 10.1149/2.019204jss

DO - 10.1149/2.019204jss

M3 - Article

SN - 2162-8769

VL - 1

SP - 175

EP - 178

JO - ECS Journal of Solid State Science and Technology

JF - ECS Journal of Solid State Science and Technology

IS - 4

ER -