Free standing interconnects for stretchable electronics

INIS

• devices 100%
• design 66%
• testing 55%
• fabrication 55%
• adhesion 44%
• etching 33%
• rubbers 22%
• horses 22%
• shoes 22%
• masks 22%
• fill factors 22%
• layers 22%
• shape 22%
• residues 22%
• failures 11%
• dynamics 11%
• islands 11%
• surfaces 11%
• oxygen 11%
• applications 11%
• adhesives 11%
• damage 11%
• plasma 11%
• metals 11%
• modifications 11%
• implementation 11%
• hard metals 11%
• comparative evaluations 11%
• ions 11%
• density 11%
• pitches 11%
• electronic circuits 11%
• humans 11%
• electronic equipment 11%
• size 11%
• mechanical properties 11%

Material Science

• Electronics 100%
• Devices 100%
• Polyimide 87%
• Adhesion 50%
• Electronic Circuit 25%
• Microfabrication 25%
• Rubber 25%
• Metal 25%
• Tensile Testing 25%
• Electronic Device 12%
• Plasma Etching 12%
• Density 12%
• Medical Device 12%
• Surface Treatment 12%
• Optical Lithography 12%

Engineering

• Interconnects 100%
• Design 46%
• Micron 30%
• Polydimethylsiloxane 30%
• Stretchability 30%
• Fill Factor 15%
• Butyl Rubber 15%
• Tensile Testing 15%
• Networks (Circuits) 15%
• Mountings 7%
• Technological Advance 7%
• Complex Shape 7%
• Conformability 7%
• User Experience 7%
• High Density 7%
• Adhesion Layer 7%
• Mechanical Properties 7%
• Large Area 7%
• Intermediate Layer 7%
• Single Chip 7%
• Reactive Ion Etch 7%
• Small Area 7%
• Stretching 7%
• Fields 7%
• Failure (Mechanical) 7%
• Health Care 7%
• Test Setup 7%
• Large Structure 7%
• Adhesive Bond 7%
• Integral Part 7%
• Stages 7%
• One Step 7%
• Electronic Devices 7%