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Free standing interconnects for stretchable electronics
Shivani Joshi
Electronic Components, Technology and Materials
Research output
:
Thesis
›
Dissertation (TU Delft)
1265
Downloads (Pure)
Overview
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INIS
adhesion
44%
adhesives
11%
applications
11%
comparative evaluations
11%
damage
11%
density
11%
design
66%
devices
100%
dynamics
11%
electronic circuits
11%
electronic equipment
11%
etching
33%
fabrication
55%
failures
11%
fill factors
22%
hard metals
11%
horses
22%
humans
11%
implementation
11%
ions
11%
islands
11%
layers
22%
masks
22%
mechanical properties
11%
metals
11%
modifications
11%
oxygen
11%
pitches
11%
plasma
11%
residues
22%
rubbers
22%
shape
22%
shoes
22%
size
11%
surfaces
11%
testing
55%
Material Science
Adhesion
50%
Density
12%
Devices
100%
Electronic Circuit
25%
Electronic Device
12%
Electronics
100%
Medical Device
12%
Metal
25%
Microfabrication
25%
Optical Lithography
12%
Plasma Etching
12%
Polyimide
87%
Rubber
25%
Surface Treatment
12%
Tensile Testing
25%
Engineering
Adhesion Layer
7%
Adhesive Bond
7%
Butyl Rubber
15%
Complex Shape
7%
Conformability
7%
Design
46%
Electronic Devices
7%
Failure (Mechanical)
7%
Fields
7%
Fill Factor
15%
Health Care
7%
High Density
7%
Integral Part
7%
Interconnects
100%
Intermediate Layer
7%
Large Area
7%
Large Structure
7%
Mechanical Properties
7%
Micron
30%
Mountings
7%
Networks (Circuits)
15%
One Step
7%
Polydimethylsiloxane
30%
Reactive Ion Etch
7%
Single Chip
7%
Small Area
7%
Stages
7%
Stretchability
30%
Stretching
7%
Technological Advance
7%
Tensile Testing
15%
Test Setup
7%
User Experience
7%