Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

F Santagata, C Farriciello, G Fiorentino, HW van Zeijl, C Silvestri, GQ Zhang, PM Sarro

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	English
Pages (from-to)	1-10
Number of pages	10
Journal	Journal of Micromechanics and Microengineering
Volume	23
Issue number	5
DOIs	https://doi.org/10.1088/0960-1317/23/5/055014
Publication status	Published - 2013

Onder dezelfde titel als artikel van 4 blz. in 2012 verschenen in Proc. IEEE Sensors 2012 met andere auteurs.

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title = "Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems",

author = "F Santagata and C Farriciello and G Fiorentino and {van Zeijl}, HW and C Silvestri and GQ Zhang and PM Sarro",

note = "Onder dezelfde titel als artikel van 4 blz. in 2012 verschenen in Proc. IEEE Sensors 2012 met andere auteurs.",

year = "2013",

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T1 - Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

AU - Santagata, F

AU - Farriciello, C

AU - Fiorentino, G

AU - van Zeijl, HW

AU - Silvestri, C

AU - Zhang, GQ

AU - Sarro, PM

N1 - Onder dezelfde titel als artikel van 4 blz. in 2012 verschenen in Proc. IEEE Sensors 2012 met andere auteurs.

PY - 2013

Y1 - 2013

U2 - 10.1088/0960-1317/23/5/055014

DO - 10.1088/0960-1317/23/5/055014

M3 - Article

SN - 0960-1317

VL - 23

SP - 1

EP - 10

JO - Journal of Micromechanics and Microengineering

JF - Journal of Micromechanics and Microengineering

IS - 5

ER -