Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

F Santagata, C Farriciello, G Fiorentino, HW van Zeijl, C Silvestri, GQ Zhang, PM Sarro

Research output: Contribution to journalArticleScientificpeer-review

11 Citations (Scopus)
Original languageEnglish
Pages (from-to)1-10
Number of pages10
JournalJournal of Micromechanics and Microengineering
Volume23
Issue number5
DOIs
Publication statusPublished - 2013

Bibliographical note

Onder dezelfde titel als artikel van 4 blz. in 2012 verschenen in Proc. IEEE Sensors 2012 met andere auteurs.

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