High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Dong Hu, Cheng Qian, Xu Liu, Leiming Du, Zhongchao Sun, Xuejun Fan, Guoqi Zhang, Jiajie Fan*

*Corresponding author for this work

Research output: Contribution to journal › Article › Scientific › peer-review

4 Citations (Scopus)
37 Downloads (Pure)

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