Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications

Varun Thukral; Irene Bacquet; Michiel Van Soestbergen; Jeroen Zaal; Romuald Roucou; Rene Rongen; Willem D. Van Driel; Guo Qi Zhang

doi:10.1109/ECTC51909.2023.00140

Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications

Varun Thukral, Irene Bacquet, Michiel Van Soestbergen, Jeroen Zaal, Romuald Roucou, Rene Rongen, Willem D. Van Driel, Guo Qi Zhang

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

16 Downloads (Pure)

Abstract

Board level vibration testing is a commonly used method to predict the solder joint reliability of surface-mounted components seated onto printed circuit boards (PCB). Current board level vibration test methods are mainly developed from a solely mechanical stress application standpoint. This makes such stress tests one dimensional in nature and translation from experimentally obtained test results to the field life of components experiencing combined stress environments become ambiguous. This investigation provides insights to develop a highly accelerated vibration test approach to cover simultaneous vibration and temperature loading situations in the field. In this paper, test board layouts from the board level drop test method, JESD22-B111 (rectangular PCB), and JESD22-B111A (square PCB), prescribed by the Joint Electronic Device Engineering Council (JEDEC), are used to understand the combined stress applied to the solder interconnects. The evaluation process is carried out by means of simulations, supported by targeted experiments on ball grid array (BGA) packages with dimensions sizing from 12x12mm to 15x15mm. The results on rectangular test board assembly show reduced characteristic lifetime of solder joints when stressed under combined temperature-vibration test conditions. On the other hand, the square-shaped board type exhibits a different acceleration factor with a longer solder fatigue lifetime than that of the rectangular-shaped PCB type. Finite element simulation results complement well with this finding.

Original language	English
Title of host publication	Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	806-813
Number of pages	8
ISBN (Electronic)	9798350334982
DOIs	https://doi.org/10.1109/ECTC51909.2023.00140
Publication status	Published - 2023
Event	73rd IEEE Electronic Components and Technology Conference, ECTC 2023 - Orlando, United States Duration: 30 May 2023 → 2 Jun 2023

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2023-May
ISSN (Print)	0569-5503

Conference

Conference	73rd IEEE Electronic Components and Technology Conference, ECTC 2023
Country/Territory	United States
City	Orlando
Period	30/05/23 → 2/06/23

Bibliographical note

Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

Ball grid Array package
Board Level Reliability
Highly Accelerated Lifetime Testing
PCB dynamic response
Temperature Coupled Vibration Test Method

Access to Document

10.1109/ECTC51909.2023.00140

Impact_of_Temperature_Cycling_Conditions_on_Board_Level_Vibration_for_Automotive_ApplicationsFinal published version, 886 KB

Cite this

Thukral, V., Bacquet, I., Van Soestbergen, M., Zaal, J., Roucou, R., Rongen, R., Van Driel, W. D., & Zhang, G. Q. (2023). Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications. In Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023 (pp. 806-813). (Proceedings - Electronic Components and Technology Conference; Vol. 2023-May). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/ECTC51909.2023.00140

Thukral, Varun ; Bacquet, Irene ; Van Soestbergen, Michiel et al. / Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications. Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers (IEEE), 2023. pp. 806-813 (Proceedings - Electronic Components and Technology Conference).

@inproceedings{6a374133c1fd42b7a63d151ceaadd48a,

title = "Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications",

abstract = "Board level vibration testing is a commonly used method to predict the solder joint reliability of surface-mounted components seated onto printed circuit boards (PCB). Current board level vibration test methods are mainly developed from a solely mechanical stress application standpoint. This makes such stress tests one dimensional in nature and translation from experimentally obtained test results to the field life of components experiencing combined stress environments become ambiguous. This investigation provides insights to develop a highly accelerated vibration test approach to cover simultaneous vibration and temperature loading situations in the field. In this paper, test board layouts from the board level drop test method, JESD22-B111 (rectangular PCB), and JESD22-B111A (square PCB), prescribed by the Joint Electronic Device Engineering Council (JEDEC), are used to understand the combined stress applied to the solder interconnects. The evaluation process is carried out by means of simulations, supported by targeted experiments on ball grid array (BGA) packages with dimensions sizing from 12x12mm to 15x15mm. The results on rectangular test board assembly show reduced characteristic lifetime of solder joints when stressed under combined temperature-vibration test conditions. On the other hand, the square-shaped board type exhibits a different acceleration factor with a longer solder fatigue lifetime than that of the rectangular-shaped PCB type. Finite element simulation results complement well with this finding. ",

keywords = "Ball grid Array package, Board Level Reliability, Highly Accelerated Lifetime Testing, PCB dynamic response, Temperature Coupled Vibration Test Method",

author = "Varun Thukral and Irene Bacquet and {Van Soestbergen}, Michiel and Jeroen Zaal and Romuald Roucou and Rene Rongen and {Van Driel}, {Willem D.} and Zhang, {Guo Qi}",

note = "Green Open Access added to TU Delft Institutional Repository {\textquoteleft}You share, we take care!{\textquoteright} – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. ; 73rd IEEE Electronic Components and Technology Conference, ECTC 2023 ; Conference date: 30-05-2023 Through 02-06-2023",

year = "2023",

doi = "10.1109/ECTC51909.2023.00140",

language = "English",

series = "Proceedings - Electronic Components and Technology Conference",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

pages = "806--813",

booktitle = "Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023",

address = "United States",

}

Thukral, V, Bacquet, I, Van Soestbergen, M, Zaal, J, Roucou, R, Rongen, R, Van Driel, WD & Zhang, GQ 2023, Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications. in Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Proceedings - Electronic Components and Technology Conference, vol. 2023-May, Institute of Electrical and Electronics Engineers (IEEE), pp. 806-813, 73rd IEEE Electronic Components and Technology Conference, ECTC 2023, Orlando, United States, 30/05/23. https://doi.org/10.1109/ECTC51909.2023.00140

Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications. / Thukral, Varun; Bacquet, Irene; Van Soestbergen, Michiel et al.
Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers (IEEE), 2023. p. 806-813 (Proceedings - Electronic Components and Technology Conference; Vol. 2023-May).

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications

AU - Thukral, Varun

AU - Bacquet, Irene

AU - Van Soestbergen, Michiel

AU - Zaal, Jeroen

AU - Roucou, Romuald

AU - Rongen, Rene

AU - Van Driel, Willem D.

AU - Zhang, Guo Qi

N1 - Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

PY - 2023

Y1 - 2023

N2 - Board level vibration testing is a commonly used method to predict the solder joint reliability of surface-mounted components seated onto printed circuit boards (PCB). Current board level vibration test methods are mainly developed from a solely mechanical stress application standpoint. This makes such stress tests one dimensional in nature and translation from experimentally obtained test results to the field life of components experiencing combined stress environments become ambiguous. This investigation provides insights to develop a highly accelerated vibration test approach to cover simultaneous vibration and temperature loading situations in the field. In this paper, test board layouts from the board level drop test method, JESD22-B111 (rectangular PCB), and JESD22-B111A (square PCB), prescribed by the Joint Electronic Device Engineering Council (JEDEC), are used to understand the combined stress applied to the solder interconnects. The evaluation process is carried out by means of simulations, supported by targeted experiments on ball grid array (BGA) packages with dimensions sizing from 12x12mm to 15x15mm. The results on rectangular test board assembly show reduced characteristic lifetime of solder joints when stressed under combined temperature-vibration test conditions. On the other hand, the square-shaped board type exhibits a different acceleration factor with a longer solder fatigue lifetime than that of the rectangular-shaped PCB type. Finite element simulation results complement well with this finding.

AB - Board level vibration testing is a commonly used method to predict the solder joint reliability of surface-mounted components seated onto printed circuit boards (PCB). Current board level vibration test methods are mainly developed from a solely mechanical stress application standpoint. This makes such stress tests one dimensional in nature and translation from experimentally obtained test results to the field life of components experiencing combined stress environments become ambiguous. This investigation provides insights to develop a highly accelerated vibration test approach to cover simultaneous vibration and temperature loading situations in the field. In this paper, test board layouts from the board level drop test method, JESD22-B111 (rectangular PCB), and JESD22-B111A (square PCB), prescribed by the Joint Electronic Device Engineering Council (JEDEC), are used to understand the combined stress applied to the solder interconnects. The evaluation process is carried out by means of simulations, supported by targeted experiments on ball grid array (BGA) packages with dimensions sizing from 12x12mm to 15x15mm. The results on rectangular test board assembly show reduced characteristic lifetime of solder joints when stressed under combined temperature-vibration test conditions. On the other hand, the square-shaped board type exhibits a different acceleration factor with a longer solder fatigue lifetime than that of the rectangular-shaped PCB type. Finite element simulation results complement well with this finding.

KW - Ball grid Array package

KW - Board Level Reliability

KW - Highly Accelerated Lifetime Testing

KW - PCB dynamic response

KW - Temperature Coupled Vibration Test Method

UR - http://www.scopus.com/inward/record.url?scp=85168307924&partnerID=8YFLogxK

U2 - 10.1109/ECTC51909.2023.00140

DO - 10.1109/ECTC51909.2023.00140

M3 - Conference contribution

AN - SCOPUS:85168307924

T3 - Proceedings - Electronic Components and Technology Conference

SP - 806

EP - 813

BT - Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023

PB - Institute of Electrical and Electronics Engineers (IEEE)

T2 - 73rd IEEE Electronic Components and Technology Conference, ECTC 2023

Y2 - 30 May 2023 through 2 June 2023

ER -

Thukral V, Bacquet I, Van Soestbergen M, Zaal J, Roucou R, Rongen R et al. Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications. In Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers (IEEE). 2023. p. 806-813. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC51909.2023.00140

Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications

Abstract

Publication series

Conference

Bibliographical note

Keywords

Access to Document

Other files and links

Fingerprint

Cite this