Abstract
We report on the degradation dynamics and mechanisms of the commercially available chip-on-board (COB) high-power light-emitting diode (LED) modules with an electrical power of 175 W. Due to the associated thermal load, the temperature dependence of the aging processes is additionally analyzed within the scope of this work. The aging tests were performed for a period of 6000 h at four different case temperatures between 55 °C and 120 °C. The results of the accelerated stress tests indicate a temperature-Activated aging process, which severely limits the lifetime of the modules. In addition, the following key findings can be reported: 1) a significant decrease in optical power occurs within 6000 h of operation; 2) depending on the stress test condition the accompanying color shifts exceed a limit of $\Delta {u}\,'{v}\,'={0}.{007}$ ; and 3) the limiting degradation mechanism can be attributed to the package of the device and can be accelerated with temperature, current, and chemicals. Reported findings can be manifested by additional optical material inspections, allowing to use the results for optimizations of future module generations.
Original language | English |
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Pages (from-to) | 6830-6836 |
Number of pages | 7 |
Journal | IEEE Transactions on Electron Devices |
Volume | 69 |
Issue number | 12 |
DOIs | |
Publication status | Published - 2022 |
Bibliographical note
Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-careOtherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Keywords
- Accelerated aging
- Ag mirror corrosion
- chip-on-board (COB)
- color shift
- high-power LED
- LED modules
- light-emitting diodes (LEDs)
- reliability