Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging

INIS

• power 100%
• porous materials 100%
• packaging 100%
• fracture toughness 100%
• notches 100%
• layers 66%
• pressure range mega pa 66%
• fractures 66%
• design 33%
• failures 33%
• width 33%
• fracture mechanics 33%
• melting points 33%
• low temperature 33%
• applications 33%
• testing 33%
• high temperature 33%
• scanning electron microscopy 33%
• sintering 33%
• geometry 33%
• nanoparticles 33%
• processing 33%
• plastics 33%
• depth 33%
• cracks 33%
• dies 33%

Material Science

• Power Electronics 100%
• Fracture Toughness 100%
• Temperature 66%
• Materials 33%
• Scanning Electron Microscopy 33%
• Fracture Behavior 33%
• Crack 33%
• High Power Electronics 33%
• Elastic Plastic Fracture Mechanics 33%
• J-Integral 33%
• Sintering 33%
• Mechanical Testing 33%
• Nanoparticle 33%

Engineering

• Elastic Plastic Fracture Mechanics 33%