Modeling methodology for linear elastic compounds modeling versus visco-elastic compound modeling

RBR van Silfhout; JGJ Beijer; K Zhang; WD van Driel

Modeling methodology for linear elastic compounds modeling versus visco-elastic compound modeling

RBR van Silfhout, JGJ Beijer, K Zhang, WD van Driel

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
Editors	LJ Ernst, GQ Zhang, P Rodgers, S Marco, O de Saint Leger
Place of Publication	Piscataway
Publisher	IEEE
Pages	483-490
Number of pages	8
ISBN (Print)	0-7803-9062-8
Publication status	Published - 2005
Event	6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Berlin, Germany - Piscataway Duration: 18 Apr 2005 → 20 Apr 2005

Publication series

Name
Publisher	IEEE

Conference

Conference	6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Berlin, Germany
Period	18/04/05 → 20/04/05

Keywords

Conf.proc. > 3 pag

Cite this

van Silfhout, RBR., Beijer, JGJ., Zhang, K., & van Driel, WD. (2005). Modeling methodology for linear elastic compounds modeling versus visco-elastic compound modeling. In LJ. Ernst, GQ. Zhang, P. Rodgers, S. Marco, & O. de Saint Leger (Eds.), Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (pp. 483-490). IEEE.

van Silfhout, RBR ; Beijer, JGJ ; Zhang, K et al. / Modeling methodology for linear elastic compounds modeling versus visco-elastic compound modeling. Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. editor / LJ Ernst ; GQ Zhang ; P Rodgers ; S Marco ; O de Saint Leger. Piscataway : IEEE, 2005. pp. 483-490

@inproceedings{d245e8d29f84463bbd3aa310fbe1c45d,

title = "Modeling methodology for linear elastic compounds modeling versus visco-elastic compound modeling",

keywords = "Conf.proc. > 3 pag",

author = "{van Silfhout}, RBR and JGJ Beijer and K Zhang and {van Driel}, WD",

year = "2005",

language = "Undefined/Unknown",

isbn = "0-7803-9062-8",

publisher = "IEEE",

pages = "483--490",

editor = "LJ Ernst and GQ Zhang and P Rodgers and S Marco and {de Saint Leger}, O",

booktitle = "Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems",

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note = "6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Berlin, Germany ; Conference date: 18-04-2005 Through 20-04-2005",

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van Silfhout, RBR, Beijer, JGJ, Zhang, K & van Driel, WD 2005, Modeling methodology for linear elastic compounds modeling versus visco-elastic compound modeling. in LJ Ernst, GQ Zhang, P Rodgers, S Marco & O de Saint Leger (eds), Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. IEEE, Piscataway, pp. 483-490, 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Berlin, Germany, 18/04/05.

Modeling methodology for linear elastic compounds modeling versus visco-elastic compound modeling. / van Silfhout, RBR; Beijer, JGJ; Zhang, K et al.
Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. ed. / LJ Ernst; GQ Zhang; P Rodgers; S Marco; O de Saint Leger. Piscataway: IEEE, 2005. p. 483-490.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Modeling methodology for linear elastic compounds modeling versus visco-elastic compound modeling

AU - van Silfhout, RBR

AU - Beijer, JGJ

AU - Zhang, K

AU - van Driel, WD

PY - 2005

Y1 - 2005

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-9062-8

SP - 483

EP - 490

BT - Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Rodgers, P

A2 - Marco, S

A2 - de Saint Leger, O

PB - IEEE

CY - Piscataway

T2 - 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Berlin, Germany

Y2 - 18 April 2005 through 20 April 2005

ER -

van Silfhout RBR, Beijer JGJ, Zhang K, van Driel WD. Modeling methodology for linear elastic compounds modeling versus visco-elastic compound modeling. In Ernst LJ, Zhang GQ, Rodgers P, Marco S, de Saint Leger O, editors, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Piscataway: IEEE. 2005. p. 483-490