PDMS-Parylene Adhesion Improvement via Ceramic Interlayers to Strengthen the Encapsulation of Active Neural Implants

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Abstract

Parylene-C has been used as a substrate and encapsulation material for many implantable medical devices. However, to ensure the flexibility required in some applications, minimize tissue reaction, and protect parylene from degradation in vivo an additional outmost layer of polydimethylsiloxane (PDMS) is desired. In such a scenario, the adhesion of PDMS to parylene is of critical importance to prevent early failure caused by delamination in the harsh environment of the human body. Towards this goal, we propose a method based on creating chemical covalent bonds using intermediate ceramic layers as adhesion promoters between PDMS and parylene.To evaluate our concept, we prepared three different sets of samples with PDMS on parylene without and with oxygen plasma treatment (the most commonly employed method to increase adhesion), and samples with our proposed ceramic intermediate layers of silicon carbide (SiC) and silicon dioxide (SiO2). The samples were soaked in phosphate-buffered saline (PBS) solution at room temperature and were inspected under an optical microscope. To investigate the adhesion property, cross-cut tape tests and peel tests were performed. The results showed a significant improvement of the adhesion and in-soak long-term performance of our proposed encapsulation stack compared with PDMS on parylene and PDMS on plasma-treated parylene. We aim to use the proposed solution to package bare silicon chips on active implants.

Original languageEnglish
Title of host publication42nd Annual International Conferences of the IEEE Engineering in Medicine and Biology Society
Subtitle of host publicationEnabling Innovative Technologies for Global Healthcare, EMBC 2020
Place of PublicationDanvers
PublisherIEEE
Pages3399-3402
Number of pages4
ISBN (Electronic)978-1-7281-1990-8
ISBN (Print)978-1-7281-1991-5
DOIs
Publication statusPublished - 2020
Event42nd Annual International Conferences of the IEEE Engineering in Medicine and Biology Society, EMBC 2020 - Montreal, Canada
Duration: 20 Jul 202024 Jul 2020

Publication series

NameProceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
Volume2020-July
ISSN (Print)1557-170X

Conference

Conference42nd Annual International Conferences of the IEEE Engineering in Medicine and Biology Society, EMBC 2020
Country/TerritoryCanada
CityMontreal
Period20/07/2024/07/20

Bibliographical note

Accepted author manuscript

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