Prediction of delamination related ic & packaging reliability problems

WD van Driel, MAJ van Gils, RBR van Silfhout, GQ Zhang

Research output: Contribution to journalArticleScientificpeer-review

32 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)1633-1638
Number of pages6
JournalMicroelectronics Reliability
Volume45
Issue number9-11
DOIs
Publication statusPublished - 2005

Keywords

  • ZX CWTS JFIS < 1.00

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