Predictive modeling of board level shock-impact reliability of the HVQFN-family

J extern de Vries, W Balemans, WD van Driel

Research output: Contribution to journalArticleScientificpeer-review

1 Citation (Scopus)


A semi-empirical model is derived to predict the board level drop-impact lifetime of HVQFN-packages soldered on a printed circuit board. The strain that evolves in the soldered interconnections is evaluated by a finite element model and related to the experimentally determined lifetime. The result is a power law and it is compared to literature data. In addition, a measure for the strain on the board is obtained analytically and compared with the experimental data. Here, too, dependence in the form of a power law is found. The combination of both results strongly suggests a near-linear relationship between the strain in the solder and the strain in the board.
Original languageEnglish
Pages (from-to)228-234
Number of pages7
JournalMicroelectronics Reliability
Issue number2
Publication statusPublished - 2010


  • academic journal papers
  • CWTS JFIS < 0.75


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