Abstract
A semi-empirical model is derived to predict the board level drop-impact lifetime of HVQFN-packages soldered on a printed circuit board. The strain that evolves in the soldered interconnections is evaluated by a finite element model and related to the experimentally determined lifetime. The result is a power law and it is compared to literature data. In addition, a measure for the strain on the board is obtained analytically and compared with the experimental data. Here, too, dependence in the form of a power law is found. The combination of both results strongly suggests a near-linear relationship between the strain in the solder and the strain in the board.
| Original language | English |
|---|---|
| Pages (from-to) | 228-234 |
| Number of pages | 7 |
| Journal | Microelectronics Reliability |
| Volume | 50 |
| Issue number | 2 |
| Publication status | Published - 2010 |
Keywords
- academic journal papers
- CWTS JFIS < 0.75