Process control in plasma decapsulation: Preventing damage to the copper wire bonds and controlled removal of Si3N4 passivation layer

J Tang, CIM Beenakker, JBJ Schelen

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationInternational conference on electronic packaging technology and high density packaging
EditorsK Bi
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages1194-1199
Number of pages6
ISBN (Print)978-146731680-4
DOIs
Publication statusPublished - 2012
Event13th International conference on electronic packaging technology and high density packaging ICEPT-HDP, Guilin, China - Piscataway, NJ, USA
Duration: 13 Aug 201216 Aug 2012

Publication series

Name
PublisherIEEE

Conference

Conference13th International conference on electronic packaging technology and high density packaging ICEPT-HDP, Guilin, China
Period13/08/1216/08/12

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