Process control in plasma decapsulation: Preventing damage to the copper wire bonds and controlled removal of Si3N4 passivation layer

J Tang; CIM Beenakker; JBJ Schelen

doi:10.1109/ICEPT-HDP.2012.6474821

Process control in plasma decapsulation: Preventing damage to the copper wire bonds and controlled removal of Si3N4 passivation layer

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	International conference on electronic packaging technology and high density packaging
Editors	K Bi
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE
Pages	1194-1199
Number of pages	6
ISBN (Print)	978-146731680-4
DOIs	https://doi.org/10.1109/ICEPT-HDP.2012.6474821
Publication status	Published - 2012
Event	13th International conference on electronic packaging technology and high density packaging ICEPT-HDP, Guilin, China - Piscataway, NJ, USA Duration: 13 Aug 2012 → 16 Aug 2012

Publication series

Name
Publisher	IEEE

Conference

Conference	13th International conference on electronic packaging technology and high density packaging ICEPT-HDP, Guilin, China
Period	13/08/12 → 16/08/12

Bibliographical note

Harvest.

Access to Document

10.1109/ICEPT-HDP.2012.6474821

Cite this

@inproceedings{020c81c00a0949ad9682d15988886b76,

title = "Process control in plasma decapsulation: Preventing damage to the copper wire bonds and controlled removal of Si3N4 passivation layer",

author = "J Tang and CIM Beenakker and JBJ Schelen",

note = "Harvest.; 13th International conference on electronic packaging technology and high density packaging ICEPT-HDP, Guilin, China ; Conference date: 13-08-2012 Through 16-08-2012",

year = "2012",

doi = "10.1109/ICEPT-HDP.2012.6474821",

language = "English",

isbn = "978-146731680-4",

publisher = "IEEE",

pages = "1194--1199",

editor = "K Bi",

booktitle = "International conference on electronic packaging technology and high density packaging",

address = "United States",

}

Tang, J , Beenakker, CIM & Schelen, JBJ 2012, Process control in plasma decapsulation: Preventing damage to the copper wire bonds and controlled removal of Si3N4 passivation layer. in K Bi (ed.), International conference on electronic packaging technology and high density packaging. IEEE, Piscataway, NJ, USA, pp. 1194-1199, 13th International conference on electronic packaging technology and high density packaging ICEPT-HDP, Guilin, China, 13/08/12. https://doi.org/10.1109/ICEPT-HDP.2012.6474821

Process control in plasma decapsulation: Preventing damage to the copper wire bonds and controlled removal of Si3N4 passivation layer. / Tang, J ; Beenakker, CIM; Schelen, JBJ.
International conference on electronic packaging technology and high density packaging. ed. / K Bi. Piscataway, NJ, USA: IEEE, 2012. p. 1194-1199.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Process control in plasma decapsulation: Preventing damage to the copper wire bonds and controlled removal of Si3N4 passivation layer

AU - Tang, J

AU - Beenakker, CIM

AU - Schelen, JBJ

N1 - Harvest.

PY - 2012

Y1 - 2012

U2 - 10.1109/ICEPT-HDP.2012.6474821

DO - 10.1109/ICEPT-HDP.2012.6474821

M3 - Conference contribution

SN - 978-146731680-4

SP - 1194

EP - 1199

BT - International conference on electronic packaging technology and high density packaging

A2 - Bi, K

PB - IEEE

CY - Piscataway, NJ, USA

T2 - 13th International conference on electronic packaging technology and high density packaging ICEPT-HDP, Guilin, China

Y2 - 13 August 2012 through 16 August 2012

ER -