Random voids generation and effect of thermal shock load on mechanical reliability of light-emitting diode flip chip solder joints

Jiajie Fan*, Jie Wu, Changzhen Jiang, Hao Zhang, Mesfin Ibrahim, Liang Deng

*Corresponding author for this work

Research output: Contribution to journal › Article › Scientific › peer-review

7 Citations (Scopus)
74 Downloads (Pure)

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