Technology platform for advanced neurostimulation implants: The “chip-in-tip” DBS probe

M.M. Kluba

Research output: ThesisDissertation (TU Delft)

255 Downloads (Pure)

Abstract

The progress in the field of neurostimulation is impressive, both from a technical as well as from a therapeutic point of view. Nowadays, the electrical stimulation of the nervous system can be used to induce or suppress muscle responses. Additionally, it can also influence hearing, vision, immune system response, pain perception, and even mental state. The number of medical conditions that can be treated using existing or completely new neurostimulation devices is continuously growing. Moreover, well-targeted electrical neuromodulation can help reduce the whole-body side effects, typical for traditional medication therapies. However, the potential of neurostimulation therapy is limited by the relatively slow development of the accompanying technologies. Most commercial neurostimulation implants still consist of a pulse generator encapsulated in a bulky titanium case and lengthy extension cords. Moreover, in some cases, such as deep brain stimulation (DBS), the resolution of the stimulation is also an issue that can cause severe side effects. In this thesis work, a technology platform for the manufacturing and packaging of advanced neurostimulation implants has been developed to enable further bioelectronics miniaturization and improve the stimulation resolution. These goals have been achieved in close collaboration with the InForMed project partners involved in finalizing the joint design, preparing the inter-facility fabrication process, and supplying off-the-shelf technology modules…
Original languageEnglish
Awarding Institution
  • Delft University of Technology
Supervisors/Advisors
  • Dekker, R., Supervisor
Award date31 Jan 2022
Print ISBNs978-94-6384-296-9
DOIs
Publication statusPublished - 2022

Funding

ECSEL JU, grant number: 2014-2-662155

Keywords

  • neurostimulation
  • directional deep brain stimulator
  • miniaturization
  • high-level integration
  • trench capacitor
  • high-definition flex-to-rigid
  • sealable trenches
  • cavity-BOX
  • biocompatible flip-chip
  • flexible interconnects
  • soft encapsulation
  • parylene
  • platinum
  • ceramics
  • parylene processing in cleanroom

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