Thermo-Mechanical Virtual Prototyping of Laminate-Based RF System-in-Package Modules

DG Yang; WD van Driel; RWJ van den Boomen; F Meeuwsen

Thermo-Mechanical Virtual Prototyping of Laminate-Based RF System-in-Package Modules

DG Yang, WD van Driel, RWJ van den Boomen, F Meeuwsen

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Abstract

Laminate-based and Silicon-based SiP approaches for RF modules are described. Laminate-based SiP approach is the mostly used one in the integration of RF modules. Failure modes, such as delamination, via cracking, excessive substrate deformation and cracking, were observed during the major packaging processes and the qualification tests with a Moisture Sensitivity Level 3 followed with a lead-free reflow profile. Experimental and virtual thermo-mechanical prototyping methodology is implemented to investigate the root cause of the failures. Advanced modeling approach is applied to model the integrated thermo-mechanical and moisture-related stress and strains.

Original language	Undefined/Unknown
Title of host publication	Proceedings of 2006 7th International Conference on Electronics Packaging Technology
Editors	Sheng Liu
Place of Publication	Shanghai, China
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	41-45
Number of pages	5
ISBN (Print)	1-4244-0620-X
Publication status	Published - 2006
Event	2006 7th International Conference on Electronics Packaging Technology - Shanghai. China Duration: 26 Aug 2006 → 29 Aug 2006

Publication series

Name
Publisher	Institute of Electrical and Electronics Engineers, Inc.

Conference

Conference	2006 7th International Conference on Electronics Packaging Technology
Period	26/08/06 → 29/08/06

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{fcc7ed8be069468eaa22ba236c0dcaa7,

title = "Thermo-Mechanical Virtual Prototyping of Laminate-Based RF System-in-Package Modules",

abstract = "Laminate-based and Silicon-based SiP approaches for RF modules are described. Laminate-based SiP approach is the mostly used one in the integration of RF modules. Failure modes, such as delamination, via cracking, excessive substrate deformation and cracking, were observed during the major packaging processes and the qualification tests with a Moisture Sensitivity Level 3 followed with a lead-free reflow profile. Experimental and virtual thermo-mechanical prototyping methodology is implemented to investigate the root cause of the failures. Advanced modeling approach is applied to model the integrated thermo-mechanical and moisture-related stress and strains.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "DG Yang and {van Driel}, WD and {van den Boomen}, RWJ and F Meeuwsen",

year = "2006",

language = "Undefined/Unknown",

isbn = "1-4244-0620-X",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

pages = "41--45",

editor = "{Sheng Liu}",

booktitle = "Proceedings of 2006 7th International Conference on Electronics Packaging Technology",

address = "United States",

note = "2006 7th International Conference on Electronics Packaging Technology ; Conference date: 26-08-2006 Through 29-08-2006",

}

Yang, DG, van Driel, WD, van den Boomen, RWJ & Meeuwsen, F 2006, Thermo-Mechanical Virtual Prototyping of Laminate-Based RF System-in-Package Modules. in Sheng Liu (ed.), Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Institute of Electrical and Electronics Engineers (IEEE), Shanghai, China, pp. 41-45, 2006 7th International Conference on Electronics Packaging Technology, 26/08/06.

Thermo-Mechanical Virtual Prototyping of Laminate-Based RF System-in-Package Modules. / Yang, DG; van Driel, WD; van den Boomen, RWJ et al.
Proceedings of 2006 7th International Conference on Electronics Packaging Technology. ed. / Sheng Liu. Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), 2006. p. 41-45.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Thermo-Mechanical Virtual Prototyping of Laminate-Based RF System-in-Package Modules

AU - Yang, DG

AU - van Driel, WD

AU - van den Boomen, RWJ

AU - Meeuwsen, F

PY - 2006

Y1 - 2006

N2 - Laminate-based and Silicon-based SiP approaches for RF modules are described. Laminate-based SiP approach is the mostly used one in the integration of RF modules. Failure modes, such as delamination, via cracking, excessive substrate deformation and cracking, were observed during the major packaging processes and the qualification tests with a Moisture Sensitivity Level 3 followed with a lead-free reflow profile. Experimental and virtual thermo-mechanical prototyping methodology is implemented to investigate the root cause of the failures. Advanced modeling approach is applied to model the integrated thermo-mechanical and moisture-related stress and strains.

AB - Laminate-based and Silicon-based SiP approaches for RF modules are described. Laminate-based SiP approach is the mostly used one in the integration of RF modules. Failure modes, such as delamination, via cracking, excessive substrate deformation and cracking, were observed during the major packaging processes and the qualification tests with a Moisture Sensitivity Level 3 followed with a lead-free reflow profile. Experimental and virtual thermo-mechanical prototyping methodology is implemented to investigate the root cause of the failures. Advanced modeling approach is applied to model the integrated thermo-mechanical and moisture-related stress and strains.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 1-4244-0620-X

SP - 41

EP - 45

BT - Proceedings of 2006 7th International Conference on Electronics Packaging Technology

A2 - Sheng Liu, null

PB - Institute of Electrical and Electronics Engineers (IEEE)

CY - Shanghai, China

T2 - 2006 7th International Conference on Electronics Packaging Technology

Y2 - 26 August 2006 through 29 August 2006

ER -