Thermomechanical analysis and reliability performance of a semiconductor package using a single gauge leadframe design

WD van Driel, JT Dellosa, WV Cacanindin

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationProceedings of the 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT
EditorsCT Liu, WC Lo
Place of PublicationPiscataway
PublisherIEEE Society
Pages75-78
Number of pages4
ISBN (Print)978-1-4673-8356-1
DOIs
Publication statusPublished - 2015
EventIMPACT 2015, Taipei, Taiwan - Piscataway
Duration: 21 Oct 201523 Oct 2015

Publication series

Name
PublisherIEEE

Conference

ConferenceIMPACT 2015, Taipei, Taiwan
Period21/10/1523/10/15

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