Thermomechanical analysis and reliability performance of a semiconductor package using a single gauge leadframe design

WD van Driel; JT Dellosa; WV Cacanindin

doi:10.1109/IMPACT.2015.7365171

Thermomechanical analysis and reliability performance of a semiconductor package using a single gauge leadframe design

WD van Driel, JT Dellosa, WV Cacanindin

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	Proceedings of the 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT
Editors	CT Liu, WC Lo
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	75-78
Number of pages	4
ISBN (Print)	978-1-4673-8356-1
DOIs	https://doi.org/10.1109/IMPACT.2015.7365171
Publication status	Published - 2015
Event	IMPACT 2015, Taipei, Taiwan - Piscataway Duration: 21 Oct 2015 → 23 Oct 2015

Publication series

Name
Publisher	IEEE

Conference

Conference	IMPACT 2015, Taipei, Taiwan
Period	21/10/15 → 23/10/15

Bibliographical note

harvest

Access to Document

10.1109/IMPACT.2015.7365171

Cite this

van Driel, WD., Dellosa, JT., & Cacanindin, WV. (2015). Thermomechanical analysis and reliability performance of a semiconductor package using a single gauge leadframe design. In CT. Liu, & WC. Lo (Eds.), Proceedings of the 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT (pp. 75-78). IEEE Society. https://doi.org/10.1109/IMPACT.2015.7365171

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title = "Thermomechanical analysis and reliability performance of a semiconductor package using a single gauge leadframe design",

author = "{van Driel}, WD and JT Dellosa and WV Cacanindin",

note = "harvest; IMPACT 2015, Taipei, Taiwan ; Conference date: 21-10-2015 Through 23-10-2015",

year = "2015",

doi = "10.1109/IMPACT.2015.7365171",

language = "English",

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van Driel, WD, Dellosa, JT & Cacanindin, WV 2015, Thermomechanical analysis and reliability performance of a semiconductor package using a single gauge leadframe design. in CT Liu & WC Lo (eds), Proceedings of the 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT. IEEE Society, Piscataway, pp. 75-78, IMPACT 2015, Taipei, Taiwan, 21/10/15. https://doi.org/10.1109/IMPACT.2015.7365171

Thermomechanical analysis and reliability performance of a semiconductor package using a single gauge leadframe design. / van Driel, WD; Dellosa, JT; Cacanindin, WV.
Proceedings of the 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT. ed. / CT Liu; WC Lo. Piscataway: IEEE Society, 2015. p. 75-78.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Thermomechanical analysis and reliability performance of a semiconductor package using a single gauge leadframe design

AU - van Driel, WD

AU - Dellosa, JT

AU - Cacanindin, WV

N1 - harvest

PY - 2015

Y1 - 2015

U2 - 10.1109/IMPACT.2015.7365171

DO - 10.1109/IMPACT.2015.7365171

M3 - Conference contribution

SN - 978-1-4673-8356-1

SP - 75

EP - 78

BT - Proceedings of the 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

A2 - Liu, CT

A2 - Lo, WC

PB - IEEE Society

CY - Piscataway

T2 - IMPACT 2015, Taipei, Taiwan

Y2 - 21 October 2015 through 23 October 2015

ER -

van Driel WD, Dellosa JT, Cacanindin WV. Thermomechanical analysis and reliability performance of a semiconductor package using a single gauge leadframe design. In Liu CT, Lo WC, editors, Proceedings of the 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT. Piscataway: IEEE Society. 2015. p. 75-78 doi: 10.1109/IMPACT.2015.7365171