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N. Gupta

  • 1 Conference contribution

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  • 2024

    Warpage deformation analysis of AMB ceramic substrates in power modules

    Hu, D., Wang, C., Li, Z., Gupta, N., Poelma, R. H., Shi, Z., Fan, J. & Zhang, G., 2024, Proceedings of the 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 9 p. (International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems).

    Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review