3D Integration for Modular Quantum Computer based on Diamond Spin Qubits

R. Ishihara*, J. Hermias, S. Neji, K. Y. Yu, M. Van Der Maas, S. Nur, T. Iwai, T. Miyatake, S. Miyahara, More Authors

*Corresponding author for this work

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

26 Downloads (Pure)

Abstract

Quantum computer chip based on spin qubits in diamond uses modules that are entangled with on-chip optical links. This enables an increased connectivity and a negligible crosstalk and error-rate when the number of qubits increases onchip. Here, 3D integration is the key enabling technology for a large-scale integration of the diamond spin qubits with photonic and electronic circuits for routing, control and readout of qubits. There are several engineering challenges to integrate the large number of spins in diamond with the on-chip circuits operating at a cryogenic temperature. In this paper we will address challenges, present recent results and discuss future outlook of the integration technology for realization of a scalable quantum computer based on diamond spin qubits.

Original languageEnglish
Title of host publicationProceedings of the 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023
Place of PublicationPiscataway
PublisherIEEE
Number of pages3
ISBN (Electronic)979-8-3503-1097-9
ISBN (Print)979-8-3503-1098-6
DOIs
Publication statusPublished - 2023
Event2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Dresden, Germany
Duration: 22 May 202325 May 2023

Conference

Conference2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023
Country/TerritoryGermany
CityDresden
Period22/05/2325/05/23

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

  • 3D integration
  • Flip-chip bonding
  • Photonic circuits
  • Quantum computer

Fingerprint

Dive into the research topics of '3D Integration for Modular Quantum Computer based on Diamond Spin Qubits'. Together they form a unique fingerprint.

Cite this