3D Integration for Modular Quantum Computer based on Diamond Spin Qubits

R. Ishihara; J.  Hermias; S. Neji; K. Y. Yu; M. Van Der Maas; S. Nur; T. Iwai; T. Miyatake; S. Miyahara; null More Authors

doi:10.1109/IITC/MAM57687.2023.10154649

3D Integration for Modular Quantum Computer based on Diamond Spin Qubits

R. Ishihara^*, J. Hermias, S. Neji, K. Y. Yu, M. Van Der Maas, S. Nur, T. Iwai, T. Miyatake, S. Miyahara, More Authors

^*Corresponding author for this work

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

29 Downloads (Pure)

Abstract

Quantum computer chip based on spin qubits in diamond uses modules that are entangled with on-chip optical links. This enables an increased connectivity and a negligible crosstalk and error-rate when the number of qubits increases onchip. Here, 3D integration is the key enabling technology for a large-scale integration of the diamond spin qubits with photonic and electronic circuits for routing, control and readout of qubits. There are several engineering challenges to integrate the large number of spins in diamond with the on-chip circuits operating at a cryogenic temperature. In this paper we will address challenges, present recent results and discuss future outlook of the integration technology for realization of a scalable quantum computer based on diamond spin qubits.

Original language	English
Title of host publication	Proceedings of the 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023
Place of Publication	Piscataway
Publisher	IEEE
Number of pages	3
ISBN (Electronic)	979-8-3503-1097-9
ISBN (Print)	979-8-3503-1098-6
DOIs	https://doi.org/10.1109/IITC/MAM57687.2023.10154649
Publication status	Published - 2023
Event	2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Dresden, Germany Duration: 22 May 2023 → 25 May 2023

Conference

Conference	2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023
Country/Territory	Germany
City	Dresden
Period	22/05/23 → 25/05/23

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

3D integration
Flip-chip bonding
Photonic circuits
Quantum computer

Access to Document

10.1109/IITC/MAM57687.2023.10154649

3D_Integration_for_Modular_Quantum_Computer_based_on_Diamond_Spin_QubitsFinal published version, 1.12 MB

Cite this

Ishihara, R., Hermias, J., Neji, S., Yu, K. Y., Van Der Maas, M., Nur, S., Iwai, T., Miyatake, T., Miyahara, S., & More Authors (2023). 3D Integration for Modular Quantum Computer based on Diamond Spin Qubits. In Proceedings of the 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 IEEE. https://doi.org/10.1109/IITC/MAM57687.2023.10154649

@inproceedings{9c3969657a3d4cb89c3c3ab1b60df04f,

title = "3D Integration for Modular Quantum Computer based on Diamond Spin Qubits",

abstract = "Quantum computer chip based on spin qubits in diamond uses modules that are entangled with on-chip optical links. This enables an increased connectivity and a negligible crosstalk and error-rate when the number of qubits increases onchip. Here, 3D integration is the key enabling technology for a large-scale integration of the diamond spin qubits with photonic and electronic circuits for routing, control and readout of qubits. There are several engineering challenges to integrate the large number of spins in diamond with the on-chip circuits operating at a cryogenic temperature. In this paper we will address challenges, present recent results and discuss future outlook of the integration technology for realization of a scalable quantum computer based on diamond spin qubits.",

keywords = "3D integration, Flip-chip bonding, Photonic circuits, Quantum computer",

author = "R. Ishihara and J. Hermias and S. Neji and Yu, {K. Y.} and {Van Der Maas}, M. and S. Nur and T. Iwai and T. Miyatake and S. Miyahara and {More Authors}",

note = "Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.; 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 ; Conference date: 22-05-2023 Through 25-05-2023",

year = "2023",

doi = "10.1109/IITC/MAM57687.2023.10154649",

language = "English",

isbn = "979-8-3503-1098-6",

booktitle = "Proceedings of the 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023",

publisher = "IEEE",

address = "United States",

}

Ishihara, R, Hermias, J, Neji, S, Yu, KY , Van Der Maas, M , Nur, S , Iwai, T, Miyatake, T, Miyahara, S & More Authors 2023, 3D Integration for Modular Quantum Computer based on Diamond Spin Qubits. in Proceedings of the 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023. IEEE, Piscataway, 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023, Dresden, Germany, 22/05/23. https://doi.org/10.1109/IITC/MAM57687.2023.10154649

3D Integration for Modular Quantum Computer based on Diamond Spin Qubits. / Ishihara, R.; Hermias, J. ; Neji, S. et al.
Proceedings of the 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023. Piscataway: IEEE, 2023.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - 3D Integration for Modular Quantum Computer based on Diamond Spin Qubits

AU - Ishihara, R.

AU - Hermias, J.

AU - Neji, S.

AU - Yu, K. Y.

AU - Van Der Maas, M.

AU - Nur, S.

AU - Iwai, T.

AU - Miyatake, T.

AU - Miyahara, S.

AU - More Authors, null

N1 - Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

PY - 2023

Y1 - 2023

N2 - Quantum computer chip based on spin qubits in diamond uses modules that are entangled with on-chip optical links. This enables an increased connectivity and a negligible crosstalk and error-rate when the number of qubits increases onchip. Here, 3D integration is the key enabling technology for a large-scale integration of the diamond spin qubits with photonic and electronic circuits for routing, control and readout of qubits. There are several engineering challenges to integrate the large number of spins in diamond with the on-chip circuits operating at a cryogenic temperature. In this paper we will address challenges, present recent results and discuss future outlook of the integration technology for realization of a scalable quantum computer based on diamond spin qubits.

AB - Quantum computer chip based on spin qubits in diamond uses modules that are entangled with on-chip optical links. This enables an increased connectivity and a negligible crosstalk and error-rate when the number of qubits increases onchip. Here, 3D integration is the key enabling technology for a large-scale integration of the diamond spin qubits with photonic and electronic circuits for routing, control and readout of qubits. There are several engineering challenges to integrate the large number of spins in diamond with the on-chip circuits operating at a cryogenic temperature. In this paper we will address challenges, present recent results and discuss future outlook of the integration technology for realization of a scalable quantum computer based on diamond spin qubits.

KW - 3D integration

KW - Flip-chip bonding

KW - Photonic circuits

KW - Quantum computer

UR - http://www.scopus.com/inward/record.url?scp=85164161172&partnerID=8YFLogxK

U2 - 10.1109/IITC/MAM57687.2023.10154649

DO - 10.1109/IITC/MAM57687.2023.10154649

M3 - Conference contribution

AN - SCOPUS:85164161172

SN - 979-8-3503-1098-6

BT - Proceedings of the 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023

PB - IEEE

CY - Piscataway

T2 - 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023

Y2 - 22 May 2023 through 25 May 2023

ER -

3D Integration for Modular Quantum Computer based on Diamond Spin Qubits

Abstract

Conference

Bibliographical note

Keywords

Access to Document

Other files and links

Fingerprint

Cite this