Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip

Hengqian Yi, E. Öztürk, Marco Koelink, Jana Krimmling, Andrei A. Damian, Wojciech Debski, H.W. van Zeijl, Guoqi Zhang, René H. Poelma*

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

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Engineering & Materials Science

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