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Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip
Hengqian Yi, E. Öztürk, Marco Koelink, Jana Krimmling, Andrei A. Damian, Wojciech Debski, H.W. van Zeijl, Guoqi Zhang, René H. Poelma*
*Corresponding author for this work
Research output: Contribution to journal › Article › Scientific › peer-review
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