TY - GEN
T1 - Cryogenic Integration for Quantum Computer Using Diamond Color Center Spin Qubits
AU - Iwai, Toshiki
AU - Kawaguchi, Kenichi
AU - Miyatake, Tetsuya
AU - Ishiguro, Tetsuro
AU - Miyahara, Shoichi
AU - Doi, Yoshiyasu
AU - Nur, Salahuddin
AU - Ishihara, Ryoichi
AU - Sato, Shintaro
N1 - Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
PY - 2023
Y1 - 2023
N2 - For quantum computing modules using diamond color centers, we propose an integrated structure of a quantum chip with photonic circuits and an interposer with electric circuits. The chip and interposer are connected via gold stud bumps using flip-chip bonding technology. For evaluating the proposed integrated structure, we bonded a test chip of 15 × 15 mm2, corresponding to the area that allows the allocation of color center qubits in the order of 102, with an interposer of 20 × 20 mm2, including test measurement lines. We confirm all connections of 16 lines with two bumps for each line at 10 K. The resistance of the lines with two bumps at 10 K is ~ 3.5O, These resistances are mainly attributed to the gold lines on the interposer, which is confirmed by simulations. The shear strength of the flip-chip bonded structure is 67 g/bump. It is larger than that of previous reports where the chips passed the standard temperature cycle test. Moreover, we integrate the flip-chip bonded structure with a printed circuit board (PCB). We confirm a connection between the connector terminal of the PCB and the test chip at 80 K. It is shown that the integrated structure using gold stud bumps has a potentially highly reliable connection at cryogenic temperature. These results will lead to realizing large-scale diamond spin quantum processors.
AB - For quantum computing modules using diamond color centers, we propose an integrated structure of a quantum chip with photonic circuits and an interposer with electric circuits. The chip and interposer are connected via gold stud bumps using flip-chip bonding technology. For evaluating the proposed integrated structure, we bonded a test chip of 15 × 15 mm2, corresponding to the area that allows the allocation of color center qubits in the order of 102, with an interposer of 20 × 20 mm2, including test measurement lines. We confirm all connections of 16 lines with two bumps for each line at 10 K. The resistance of the lines with two bumps at 10 K is ~ 3.5O, These resistances are mainly attributed to the gold lines on the interposer, which is confirmed by simulations. The shear strength of the flip-chip bonded structure is 67 g/bump. It is larger than that of previous reports where the chips passed the standard temperature cycle test. Moreover, we integrate the flip-chip bonded structure with a printed circuit board (PCB). We confirm a connection between the connector terminal of the PCB and the test chip at 80 K. It is shown that the integrated structure using gold stud bumps has a potentially highly reliable connection at cryogenic temperature. These results will lead to realizing large-scale diamond spin quantum processors.
KW - Cryogenic integration
KW - Diamond color center
KW - Flip-chip bonding
KW - Quantum computer
UR - http://www.scopus.com/inward/record.url?scp=85168307087&partnerID=8YFLogxK
U2 - 10.1109/ECTC51909.2023.00165
DO - 10.1109/ECTC51909.2023.00165
M3 - Conference contribution
AN - SCOPUS:85168307087
T3 - Proceedings - Electronic Components and Technology Conference
SP - 967
EP - 972
BT - Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023
PB - Institute of Electrical and Electronics Engineers (IEEE)
T2 - 73rd IEEE Electronic Components and Technology Conference, ECTC 2023
Y2 - 30 May 2023 through 2 June 2023
ER -