Yield Improvement for 3D wafer-to-wafer stacked ICs using wafer matching

M Taouil, S Hamdioui, EJ Marinissen

Research output: Contribution to journalArticleScientificpeer-review

5 Citations (Scopus)
Original languageEnglish
Pages (from-to)1-23
Number of pages23
JournalACM Transactions on Design Automation of Electronic Systems
Volume20
Issue number2
DOIs
Publication statusPublished - 2015

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