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Research Output

2010

Theory of aluminum metallization corrosion in microelectronics

van Soestbergen, M., Mavinkurve, A., Rongen, RTH., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2010, In : Electrochimica Acta. 55, p. 5459-5469 11 p.

Research output: Contribution to journalArticleScientificpeer-review

27 Citations (Scopus)
2009

Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements

Zaal, JJM., van Driel, WD., Kessels, FJHG. & Zhang, GQ., 2009, In : Journal of Electronic Packaging. 131, 011007, p. 1-9 9 p.

Research output: Contribution to journalArticleScientificpeer-review

14 Citations (Scopus)

Modeling Electrochemical Migration through Plastic Microelectronics Encapsulations

van Soestbergen, M., Mavinkurve, A., Rongen, RTH., Ernst, LJ. & Zhang, GQ., 2009, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, 10-13 August 2009, Beijing, China. Bi, K & Cai, J (eds.). Beijing, China: IEEE Society, p. 1079-1082 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics

van der Sluis, O., Engelen, RAB., Timmermans, PHM. & Zhang, GQ., 2009, In : Microelectronics Reliability. 49, p. 853-860 8 p.

Research output: Contribution to journalArticleScientificpeer-review

11 Citations (Scopus)

Numerical prediction of failure paths at a roughened metal/polymer interface

Noijen, SPM., van der Sluis, O., Timmermans, PHM. & Zhang, GQ., 2009, In : Microelectronics Reliability. 49, 2009, p. 1315-1318 4 p.

Research output: Contribution to journalArticleScientificpeer-review

12 Citations (Scopus)

On Electrochemical Cell Modeling as Basis for Predicting Corrosion Failures in Plastic Encapsulated Microelectronics

van Soestbergen, M., Rongen, RTH., Mavinkurve, A., Zhang, GQ. & Ernst, LJ., 2009, Proceedings of EuroSimE 2009. Ernst, L. J., Zhang, G. Q., Driel, W. D. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Delft: IEEE Society, p. 1-7 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

1 Citation (Scopus)

On Wire Failures in Microelectronic Packages

van Driel, WD., van Silfhout, RBR. & Zhang, GQ., 2009, In : IEEE Transactions on Device and Materials Reliability. 9, 1, p. 1-7 7 p.

Research output: Contribution to journalArticleScientificpeer-review

12 Citations (Scopus)

Quo Vadis, Micro/NanoReliability

Zhang, GQ. & van Driel, WD., 2009, In : Micromaterials and Nanomaterials. 09, p. 14-17 4 p.

Research output: Contribution to journalArticleScientific

Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding

Zaal, JJM., van Driel, WD., Verheijden, GJAM. & Zhang, GQ., 2009, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 10-13, 2009, Beijing, China. s.n. (ed.). Beijing, China: IEEE Society, p. 679-683 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

1 Citation (Scopus)

Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull

Zaal, JJM., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2009, In : Microelectronics Reliability. 49, 2009, p. 846-852 7 p.

Research output: Contribution to journalArticleScientificpeer-review

9 Citations (Scopus)

The Changing Landscape of Micro/Nanoelectronics

Zhang, GQ. & van Roosmalen, AJ., 2009, More than Moore, Creating High Value Micro/Nanoelectronics Systems. Zhang, GQ & Roosmalen, AJ (eds.). Dordrecht, Heidelberg, London, New York: Springer, p. 1-31 332 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

8 Citations (Scopus)
2008

Advances in delamination modeling

van der Sluis, O., Yuan, CA., van Driel, WD. & Zhang, GQ., 2008, Nanopackaging: Nanotechnologies and Electronics Packaging. Morris, JE. (ed.). Springer, p. 1-34 549 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

Aging Effects on IMC Formation and Joint Strength of Low-Ag SAC Solder/UBM (Ni (P)-Au) for WLCSP

Sun, F., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 308-311 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

An Alternative Solder Interconnect Reliability Test to Evaluate Drop Impact Performance

Zaal, JJM., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1181-1186 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

5 Citations (Scopus)

Assessment of testing methodologies for thin-film vacuum MEMS packages

Li, Q., Goosen, JFL., van Keulen, F., van Beek, JTM. & Zhang, GQ., 2008, In : Microsystem Technologies: micro and nanosystems - information storage and processing systems. p. 161-168 8 p.

Research output: Contribution to journalArticleScientificpeer-review

Correlating Drop Impact Simulations with Drop Impact Testing using High-Speed Camera Measurements

Zaal, JJM., van Driel, WD., Kessels, FJHG. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 567-572 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

5 Citations (Scopus)

Delamination modeling of three-dimensional microelectronic systems

van der Sluis, O., Timmermans, PHM., van Silfhout, RBR., van Driel, WD. & Zhang, GQ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1593-1600 8 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

3 Citations (Scopus)

Die Fracture Probability Prediction and Design Guidelines for Laminate-Based Over-Molded Packages

Yang, D., Bielen, JA., Theunis, F., van Driel, WD. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 228-233 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

6 Citations (Scopus)

Driving Mechanisms of Delamination Related Reliability Problems in Exposed Pad Packages

van Driel, WD., van Gils, M., Fan, X., Zhang, GQ. & Ernst, LJ., 2008, In : IEEE Transactions on Components and Packaging Technology. 31, 2, p. 260-268 9 p.

Research output: Contribution to journalArticleScientificpeer-review

26 Citations (Scopus)

Effect of aging of packaging materials on die surface cracking of a SiP carrier

Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O., Zhang, GQ., Regard, C., Gautier, C. & Frémont, H., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 361-364 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Effect of Package Type in IC-Package Stress Interaction Design Rules

van Driel, WD., Yang, D. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 27-30 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Electrical Characterization Of Plastic Encapsulations Using An Alternative Gate Leakage Test Method

van Soestbergen, M., Rongen, RTH., Knol, J., Mavinkurve, A., Egbers, JH., Nath, S., Zhang, GQ. & Ernst, LJ., 2008, 2008 IEEE International Reliability Physics Symposium Proceedings 46th Annual, Phoenix, Arizona, April 27-May 1, 2008. Cole, E.I., Graas, C.D., McPherson, J.W., Street, A.G., Kasprzak, L.A., Mielke, N.R., Suehle, J.S., Lacoe, R.C., Schafft, H.A. & Tonti, W.R. (eds.). Phoenix, AZ: IEEE Society, p. 462-467 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

6 Citations (Scopus)

Failure analysis of a thin-film nitride MEMS package

Li, Q., Goosen, JFL., van Beek, JTM., van Keulen, F., Phan, KL. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, p. 1557-1561 5 p.

Research output: Contribution to journalArticleScientificpeer-review

15 Citations (Scopus)

Failure modelling in flexible electronics

van der Sluis, O., Engelen, RAB., Timmermans, PHM. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 468-474 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP

Sun, F., Hochstenbach, P., van Driel, WD. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, 8-9, p. 1167-1170 4 p.

Research output: Contribution to journalArticleScientificpeer-review

37 Citations (Scopus)

Hermeticity and thermal stability testing of PECVD silicon nitride thin-film packages

Li, Q., Goosen, JFL., van Beek, JTM., van Keulen, F., Phan, KL., van Velzen, B., Bontemps, JJM., Koning, JJ. & Zhang, GQ., 2008, International Conference on Electronics Packaging 2008. Nishida, H. (ed.). Tokyo: JIEP, p. 220-225 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning

Fan, X., Zhang, GQ., van Driel, WD. & Ernst, LJ., 2008, In : IEEE Transactions on Components and Packaging Technology. 31, 2, p. 252-259 8 p.

Research output: Contribution to journalArticleScientificpeer-review

59 Citations (Scopus)

Ionic polarisation layers in polymer electrolytes

Biesheuvel, PM., van Soestbergen, M., Mavinkurve, A., Ernst, LJ. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 644-648 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

7 Citations (Scopus)

Mechanical Reliability of MEMS Packages

van Driel, WD., Zaal, JJM., Yang, D., van Kleef, M. & Zhang, GQ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1751-1754 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

3 Citations (Scopus)

Modeling ion transport through molding compounds and its relation to product reliability

van Soestbergen, M., Rongen, RTH., Ernst, LJ. & Zhang, GQ., 2008, Proceedings 2008 International conference on electronic packaging technology & high density packaging. Bi, K. & Xiao, F. (eds.). IEEE Society, p. 1-8 8 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

9 Citations (Scopus)

Modified Poisson-Nernst-Planck theory for ion transport in polymeric electrolytes

van Soestbergen, M., Biesheuvel, PM., Rongen, RTH., Ernst, LJ. & Zhang, GQ., 2008, In : Journal of Electrostatics. 66, 2008, p. 567-573 7 p.

Research output: Contribution to journalArticleScientificpeer-review

26 Citations (Scopus)

Molecular simulation strategy for mechanical modeling of amorphous/porous low-dielectric constant materials

Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., Flower, AE. & van Silfhout, RBR., 2008, In : Applied Physics Letters. 92, p. 1-3 3 p.

Research output: Contribution to journalArticleScientificpeer-review

13 Citations (Scopus)

Morphology, Evolution and Performance of IMC in SAC105 Solder/UBM (Ni (P)-Au)

Sun, F. L., Hochstenbach, P., Van Driel, W. D. & Zhang, G. Q., 2008, 2008 International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP 2008), Shanghai, China. IEEE, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

On chip-package stress interaction

van Driel, WD., Yang, DG. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, 8-9, p. 1268-1272 5 p.

Research output: Contribution to journalArticleScientificpeer-review

5 Citations (Scopus)

Packaging influences on the reliability of MEMS resonators

Zaal, JJM., van Driel, WD., Bendida, S., Li, Q., van Beek, JTM. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, p. 1567-1571 5 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
2 Citations (Scopus)

Reliability of wirebonds in micro-electronic packages

van Driel, WD., van Silfhout, RBR. & Zhang, GQ., 2008, In : Microelectronics International: an international journal. 25, 2, p. 15-22 8 p.

Research output: Contribution to journalArticleScientificpeer-review

9 Citations (Scopus)

Testing Solder Interconnect Reliability Under Drop Impact Loading Conditions

Zaal, JJM., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 274-279 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

1 Citation (Scopus)

The mechanical influence of the porosity and nano-scale pore size effect of the SiOC(H) dielectric film

Yuan, CA., Flower, AE., van der Sluis, O., Zhang, GQ., Ernst, LJ., Cherkaoui, M. & van Driel, WD., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 199-203 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

The mechanical influence of the porosity and nano-scale pore size effect of the SiOC(H) dielectric film

Yuan, CA., Flower, AE., van der Sluis, O., Zhang, GQ., Ernst, LJ., Cherkaoui, M. & van Driel, WD., 2008, Proceedings of EuroSimE 2008. Ernst, LJ., Zhang, GQ., van Driel, WD., Rodgers, P. & de Saint Leger, O. (eds.). Freiburg: IEEE Society, p. 27-30 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

The need for multi-scale approaches in Cu/low-k reliability issues

Yuan, CA., van der Sluis, O., van Driel, WD. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, p. 833-842 10 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
3 Citations (Scopus)

The Role of the Molecular Simulation Approach for IC-backend Developments

Yuan, C., van der Sluis, O., van Driel, W. D. & Zhang, G. Q., 2008, 2008 International Conference on Electronics Packaging Technology and High Density Packaging. IEEE, 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

Verification of Drop Impact Simulations Using High-Speed Camera Measurements

Zaal, JJM., van Driel, WD., Kessels, FJHG. & Zhang, GQ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 2149-2155 7 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

6 Citations (Scopus)
2007

Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability

Wymyslowski, A., van Driel, WD., van de Peer, J., Tzannetakis, N. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 280-289 10 p.

Research output: Contribution to journalArticleScientificpeer-review

5 Citations (Scopus)

Advanced structural similarity rules for the BGA package family

van Driel, WD., Mavinkurve, A., van Gils, MAJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 205-214 10 p.

Research output: Contribution to journalArticleScientificpeer-review

10 Citations (Scopus)

Characterization of moisture properties of polymers for IC packaging

Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 1685-1689 5 p.

Research output: Contribution to journalArticleScientificpeer-review

11 Citations (Scopus)

Chemical-mechanical relationship of amorphous/porous low-dielectric film materials

Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., van Silfhout, RBR. & Thijsse, BJ., 2007, In : Computational Materials Science. 42, p. 606-613 8 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
15 Citations (Scopus)

Correlation between chemistry of polymer building blocks and microelectronics reliability

Bressers, HJL., van Driel, WD., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 290-294 5 p.

Research output: Contribution to journalArticleScientificpeer-review

2 Citations (Scopus)

Design and fabrication of micro-system embedding in flexible substrates

WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Ernst, LJ. & Zhang, GQ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 311-315 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Effect of filler concentration of rubbery shear and bulk modulus of molding compounds

Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Bressers, HJL. & Janssen, JHJ., 2007, In : Microelectronics Reliability. 47, p. 233-239 7 p.

Research output: Contribution to journalArticleScientificpeer-review

25 Citations (Scopus)

Mechanical characterization of deformable ultra-thin substrates by experiment and FE simulation

WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Zhang, GQ. & Ernst, LJ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 1056-1061 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review