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2020

Impedance Spectroscopy for Enhanced Data Collection of Conductometric Soot Sensors

Middelburg, L. M., Ghaderi, M., Bilby, D., Visser, J. H., Zhang, K. & Wolffenbuttel, R. F., 2020, 2020 IEEE 29th International Symposium on Industrial Electronics (ISIE). IEEE, p. 1099-1103 5 p. 9152484

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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3 Downloads (Pure)

Implementation of General Coupling Model of Electromigration in ANSYS

Cui, Z., Fan, X. & Zhang, G., 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). O'Conner, L. & Torres, H. (eds.). Piscataway: IEEE, p. 1632-1637 6 p. 9159445

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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2 Downloads (Pure)

Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration

Liu, P., Li, J., van Zeijl, H. & Zhang, G., 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC): Proceedings. O'Conner, L. (ed.). Piscataway: IEEE, p. 817-823 7 p. 9159329

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2019

A Novel Partial Carrier Stored and Hole Path IGBT for Ultralow Turn-Off Loss and On-State Voltage With High EMI Noise Controllability

Wang, S., Tan, C., Wang, L., Luo, H., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 410-412 3 p. 8731110

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

A SPICE-based transient thermal-electronic model for LEDs

Sun, B., Fan, J., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-5 5 p. 8724555

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Degradation of bisphenol-a-polycarbonate (BPA-PC) optical lenses under simulated harsh environment conditions

Mehr, M. Y., Van Driel, W. & Zhang, K., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. Institute of Electrical and Electronics Engineers (IEEE), p. 1-4 4 p. 8724524

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Degradation Prediction of Electronic Packages using Machine Learning

Prisacaru, A., Guerrero, E. O., Gromala, P. J., Han, B. & Zhang, G. Q., 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-9 9 p. 8724523

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances

Qu, Z., Tang, H., Ye, H., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-5 5 p. 8724549

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Lifetime prediction of ultraviolet light-emitting diodes with accelerated wiener degradation process

Jing, Z., Ibrahim, M. S., Fan, J., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-8 8 p. 8724571

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications

Zhang, B., Wei, J., Bottger, A. J., van Zeijl, H. W., Sarro, P. M. & Zhang, G., 2019, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE, p. 1772-1775 4 p. 8808192

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Novel Two-dimensional Semiconductor Monolayer SnP2 with Tunable Bandgap

Zhang, Y., Tao, L., Li, X., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 276-278 3 p. 8731255

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2018

AlGaN/GaN HEMT micro-sensor technology for gas sensing applications

Sokolovskij, R., Zhang, J., Jiang, Y., Chen, G., Zhang, G. Q. & Yu, H., 2018, ICSICT-2018 - 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) Proceedings. Jiang, Y-L., Tang, T-A. & Ye, F. (eds.). Piscataway, NJ: IEEE, p. 1-4 4 p. 8564904

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps

Sun, B., Fan, J., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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1 Citation (Scopus)
12 Downloads (Pure)

A tunable THz wave modulator based on graphene

Zhang, F., Chen, X-P., Wei, Q., Yuan, L-B., Cai, M., Ye, H-Y., Zhang, G-Q. & Xiao, J., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)

Designing a 100 [aF/nm] capacitive transducer

Middelburg, L. M., Mansouri, B. E., Poelma, R. H., Van Zeijl, H. W., Wei, J., Zhang, G. Q. & Van Driel, W. D., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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24 Downloads (Pure)

Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation

Fan, J., Hu, A., Pecht, M., Chen, W., Fan, X., Xu, D. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 1642-1648 7 p. 8480748

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)

High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology

Hou, F., Guo, X., Wang, Q., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC): Proceedings. O'Conner, L. (ed.). Piscataway, NJ: IEEE, p. 1365-1370 6 p. 8429721

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

4 Citations (Scopus)

Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

Cui, Z., Zhang, Y., Yang, Q., Zhang, G. & Chen, X., 2018, Proceedings - 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018. Piscataway, NJ: IEEE, p. 68-70 3 p. 8421434

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

Cui, Z., Chen, X., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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13 Downloads (Pure)

Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor

Prisacaru, A., Sun, Y., Gromala, P. J., Han, B. & Zhang, G. Q., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Modeling of Two-Dimensional Hyperbolic Heat Conduction in Silicon-On-Insulator Transistor by Equivalent RLC Network

Mirza Gheytaghi, A., Zhang, G. Q. & Ye, H., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Non-linear bulk micromachined accelerometer for high sensitivity applications

Middelburg, L. M., Mansouri, B. E., Poelma, R., Zhang, G. Q., van Zeijl, H. & Wei, J., 2018, 2018 IEEE SENSORS Proceedings. Roy, A. & Gianchandani, Y. (eds.). Piscataway, NJ: IEEE, Vol. 2018-October. p. 1-4 4 p. 8589630

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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51 Downloads (Pure)

SiC MOSFET Threshold-Voltage Instability under High Temperature Aging

Liu, Y., Chen, X., Zhao, Z., Li, Z., Lu, C., Zhang, J., Ye, H., Koh, S. W., Wang, L. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 347-350 4 p. 8480781

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs

Wang, Z., Fan, J., Liu, J., Hu, A., Qian, C., Fan, X. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xioa, F., Wang, J., Chen, J. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 525-530 6 p. 8480566

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)

The performance of sintered nanocopper interconnections for high temperature device

Liu, Q., Chen, X., Zhu, J., Zhang, H., Zhang, J. S., Zhang, J. G., Wang, L., Ye, H., Koh, S. W. & Zhang, G. O., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 1476-1478 3 p. 8480591

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)

Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing

Huang, Z. Q., Poelma, R. H., Vollebregt, S., Koelink, M. H., Boschman, E., Kropf, R., Gallouch, M. & Zhang, G. Q., 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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2017

A PoF and statistics combined reliability prediction for LED arrays in lamps

Sun, B., Fan, X., Fan, J., Zhang, G. Q. & Qian, C., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Piscataway, NJ: IEEE, p. 1-5 5 p. 7926264

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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1 Citation (Scopus)
15 Downloads (Pure)

Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units

Prisacaru, A., Palczynska, A., Gromala, P. J., Han, B. & Zhang, G. Q., Jun 2017, Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Piscataway, NJ: IEEE, p. 1119-1127 9 p. 7999824

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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4 Citations (Scopus)
18 Downloads (Pure)

High aspect ratio spiral resonators for process variation investigation and MEMS applications

Middelburg, L. M., Mansouri, B. E., Van Zeijl, H. W., Zhang, G. Q. & Poelma, R. H., 2017, Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ: IEEE, p. 1-3 3 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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12 Downloads (Pure)

Horizontally aligned carbon nanotube scaffolds for freestanding structures with enhanced conductivity

Silvestri, C., Marciano, F., Morana, B., Podranovic, V., Vollebregt, S., Zhang, G. Q. & Sarro, P. M., 2017, MEMS 2017: 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems. Piscataway, NJ: IEEE, p. 266-269 4 p. 7863392

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Prognostics and health monitoring of electronic system: A review

Prisacaru, A., Gromala, P. J., Jeromio, M. B., Han, B. & Qi Zhang, G., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Piscataway, NJ: IEEE, p. 1-11 11 p. 7926248

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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5 Citations (Scopus)
28 Downloads (Pure)

Pt-AlGaN/GaN HEMT-sensor layout optimization for enhancement of hydrogen detection

Sokolovskij, R., Iervolino, E., Zhao, C., Wang, F., Yu, H., Santagata, F., Sarro, P. M. & Zhang, G. Q., 2017, Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ: IEEE, p. 1-3 3 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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3 Citations (Scopus)
98 Downloads (Pure)

Reliability Optimization of Gold-Tin Eutectic Die Attach Layer in HEMT Package

Zhang, H., Fan, J., Zhang, J., Qian, C., Fan, X., Sun, F. & Zhang, G. Q., 2017, 2016 13th China International Forum on Solid State Lighting (SSLChina). IEEE, p. 52-56 5 p. 16579876

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)

Smart Systems Integration in the era of Solid State Lighting

van Driel, W., Zhang, G. Q., van Zeijl, H., Poelma, R., Koladouz Esfahani, Z., Ramachandrappa Venkatesh, M., Middelburg, L. & El Mansouri, B., 2017, Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Otto, T. (ed.). Frankfurt: Mesago Messe Frankfurt GmbH, p. 160-165 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study

Tang, H., Ye, H., Chen, X., Fan, X. & Zhang, G., 10 May 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Institute of Electrical and Electronics Engineers (IEEE), 7926247

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)
2016

3D interconnect technology based on low temperature copper nanoparticle sintering

Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
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3 Citations (Scopus)
52 Downloads (Pure)

A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers

Sun, B., Fan, X., van Driel, W. & Zhang, G. Q., 18 Apr 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ: IEEE, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)

Electro-thermal analysis and design of a combined MEMS impedance and micro hotplate device for gas sensing applications

Venkatesh, M., Mansouri, B. E., Wei, J., Bossche, A. & Zhang, G. Q., 5 May 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, p. 1-9 9 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)

Lumen Decay Prediction in LED Lamps

Sun, B., Fan, X., van Driel, W., Michel, T., Zhou, J. & Zhang, G. Q., 18 Apr 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ: IEEE, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)

Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

van Zeijl, H., Carisey, Y., Damian, A., Poelma, R., A, Z. & Zhang, G. Q., 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). O'Conner, L. (ed.). Piscataway: IEEE, p. 217-224 8 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

4 Citations (Scopus)

Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling

Poelma, R., Fan, X. J., Schlangen, E., van Zeijl, H. & Zhang, G. Q., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, p. 1-6 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2015

Accelerated reliability test method for optics in LED luminaire applications

Yazdan Mehr, M., van Driel, WD. & Zhang, GQ., 2015, Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
1 Citation (Scopus)

An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

Mehr, M. Y., Bahrami, A., Fischer, H., Gielen, S., Corbeij, R., Van Driel, W. D. & Zhang, G. Q., 1 Jan 2015, 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers (IEEE), 7103077

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

9 Citations (Scopus)

An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

Yazdan Mehr, M., Bahrami, A., Fischer, H., Gielen, S., Corbeij, R., van Driel, WD. & Zhang, GQ., 2015, Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access

Junction temperature measurement to optimize thermal design of LED arrays

Ye, H., Tang, H., Leung, S., Qian, C., Fan, X. & Zhang, G., Nov 2015, 12th China International Forum on Solid State Lighting, SSLCHINA 2015. Piscataway, NJ: IEEE Society, p. 47-51 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

4 Citations (Scopus)

Review on retrofit G4 LED lamps: Technology, challenges, and future trends

Liu, P., van Zeijl, HW., Venkatesh, MR., Sokolovskij, R., Kurt, R. & Zhang, GQ., 2015, Proceedings - 65th Electronic Components and Technology Conference. Keser, B. & Braunisch, H. (eds.). Piscataway, NJ, USA: IEEE Society, p. 2277-2282 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
1 Citation (Scopus)

Tunable binary Fresnel lens based on stretchable PDMS/CNT composite

Li, X., Wei, L., Vollebregt, S., Poelma, RH., Shen, Y., Wei, J., Urbach, HP., Sarro, PM. & Zhang, GQ., 2015, Proceedings of the 2015 Transducers - 2015 18th Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS. Kenny, TW. & Bright, VM. (eds.). Piscataway: IEEE Society, p. 2041-2044 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
5 Citations (Scopus)
2014

A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations

Sun, B., Fan, X., Zhao, L., Yuan, CA., Koh, SW. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
1 Citation (Scopus)

A model in predicting color of LED packages with different phosphor layer dimensions

Wong, CKY., Leung, SYY., Xiong, YJ., Yuan, CCA. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
4 Citations (Scopus)

A novel design of heatsink-less LED base fluorescent lamp retrofit

Zhao, J., Liu, Y., Tang, H., Leung, SYY., Yuan, CCA. & Zhang, GQ., 2014, Proceedings of the 15th International Conference on Electronic Packaging Technology. Bi, K., Tian, Z. & Xu, Z. (eds.). Piscatawa, NJ, USA: IEEE Society, p. 1202-1207 6 p.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Open Access
1 Citation (Scopus)